1、高级硬件工程师英文简历表格考的材料，毕竟以后的工作都是围绕产品展开。Name：XXXHukou：ShanghaiResidency：ShanghaiWork Experience：Current Salary：Tel：E-mail： XXX Career ObjectiveDesired Industry：Electronics/Semiconductor/IC ,Science/Research ,Government ,Others ,Testing, CertificationDesired Position：Senior Hardware Engineer ,Semiconductor
2、 Technology, Branch Office Manager ,Chief Representative ,Research Specialist StaffDesired address：Shanghai ,Hongkong ,Beijing ,Taiwan ,MacaoDesired Salary：NegotiableWork Experience2023/06;PresentxxxCompanyIndustry: Electronics/Semiconductor/ICIntel Flash Engineering Department Individual Contributo
3、r Responsibilities：I have been working in Intel Flash Assembly & Test EngineeringDepartment as an Individual Contributor since June of 2023.Being Leader of ATE Yield team, I have been working with the team members to improve the products yield. Our efforts are paid off:The yield of year 2023has
4、been dramatically increased than that of year 2023.The yield of all products, consecutively meets the goal.The total amount of cost saving due to yield improvement is more than $1 million compared with year 2023. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a se
5、t of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 2023.Report Directly to: Department ManagerNumber of Subordinate: 14Reference: Bao Po
6、welAchievements: Being Leader of ATE Yield team, I have been working with the team members to improve the products yield.Our efforts are paid off:The yield of year 2023has been dramatically increased than that of year 2023.The yield of all products, consecutively meets the goal.The total amount of c
7、ost saving due to yield improvement is more than $1 million compared with year 2023. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team membe
8、rs, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 2023.2023/01;2023/05Intel(Shanghai) Technology Development Ltd. CompanyIndustry: Electronics/Semiconductor/ICIntel STTD-China Department Electronics Development Engineer Responsibilities：I had been working in STTD
9、-China since Jan 2023to May 2023as a senior module engineer.At that time, as a main contributor of this project, we succeeded in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one time.Report Directly to: Hopman MarkNumber of Subordinate: 1
10、4Reference: Bao PowelReason for Leaving: I was transferred to IntelShanghaiProducts Ltd. Company due to the internal re-organization in June of 2023.Achievements: As a main contributor of STTD-China department, I co-work with my colleagues to succeed in developing a set of MASSIVELY PARALLEL CLASS T
11、EST equipment, which is able to test more than 6700 units in one cycle.2023/05;2023/01Nanyang University of Science & TechnologyIndustry: Electronics/Semiconductor/ICElectronics & Electrical Engineering Department Research Fellow Responsibilities：I work in Electronics & Electrical Engine
12、ering Department of Nanyang University of Science & Technology as a Research Fellow.I majored at Gate Oxide Reliability Research in the duration.Report Directly to: Professor Pey Kin LeohSubordinate: 3Reference: Patrick LowReason for Leaving: I completed the project which I undertook by myself,
13、and want to do more challenging job.Achievements: In less than one year, I made a lot of experiments and acquired the wonderful data for the project by myself.Project Experience2023/01;PresentAssembly NPI (New Product Introduction)Project Description: To introduce more products into Intel Flash Asse
14、mbly factory, I join Assembly NPI team and work as the team leader. I coordinate with IE, Planner, Marketing guy and Engineer to select new product items, do demo in factory, and then qualify it.Responsibility: I am working as NPI Team leader and coordinate all team members, define the NPI candidate
15、, make Assembly build plan, follow up the progress.2023/01;2023/12Marginal Electrical Boards RescueProject Description: To rescue some electrical boards of testing equipment, a Task Force team was built up and led by me. We categorized each kind of board, made historical failure analysis on each kin
16、d of board and around &2.5 million dollars was saved finally.Responsibility: Being the team leader, I took the job of data analysis, define each member's role, make program plan, coordinate each team member and follow up the progress.2023/10;2023/05Optimization the current Test Process Order for Flash MemoryProject Description: To simplify the current Test procedure and enhance the working efficiency, a Task Force team has been called and started by me.Responsibility: Being th
