1、Designation:F151399(Reapproved 2011)Standard Specification forPure Aluminum(Unalloyed)Source Material for ElectronicThin Film Applications1This standard is issued under the fixed designation F1513;the number immediately following the designation indicates the year oforiginal adoption or,in the case
2、of revision,the year of last revision.A number in parentheses indicates the year of last reapproval.Asuperscript epsilon()indicates an editorial change since the last revision or reapproval.1.Scope1.1 This specification covers pure aluminum metal(unal-loyed)for use in evaporation sources and sputter
3、ing targets.This material is intended as a raw material for electronicapplications.The material is used as-supplied in some cases(for example,as e-beam evaporation sources).In other in-stances it may be remelted,alloyed,cast and processed by thepurchaser to make finished products(for example,sputter
4、ingtargets).1.2 This specification sets purity grade levels,physicalattributes,analytical methods,and packaging.1.3 The values stated in SI units are to be regarded asstandard.No other units of measurement are included in thisstandard.2.Referenced Documents2.1 ASTM Standards:2D1971 Practices for Dig
5、estion of Water Samples for Deter-mination of Metals by FlameAtomicAbsorption,GraphiteFurnace Atomic Absorption,Plasma Emission Spectros-copy,or Plasma Mass Spectrometry3.Terminology3.1 material lotmaterial melted and cast from one cruciblecharge.4.Classification4.1 Grades of aluminum are defined in
6、 Table 1.Impuritycontents are reported in parts per million by weight(wt ppm).4.2 Purity and total metallic impurity levels are based uponelements listed in Table 2.5.Ordering Information5.1 Orders for pure aluminum source material shall includethe following:5.1.1 Grade(4.1),5.1.2 Configuration(8.1
7、and 8.2),5.1.3 Whether or not certification is required(12.1),and5.1.4 Whether or not a sample representative of the finishedproduct is required to be provided by the supplier to thepurchaser.6.Impurities6.1 The minimum suite of metallic impurity elements to beanalyzed is defined in Table 2.Acceptab
8、le analysis methodsand detection limits are specified in Section 11.Elements notdetected will be counted and reported as present at thedetection limit.Additional elements may be analyzed andreported,as agreed upon between the supplier and the pur-chaser,but these shall not be counted in defining the
9、 gradedesignation.6.2 Nonmetalic elements to be analyzed and reported are C,H,O,N,and S.6.3 Acceptable limits and analytical techniques for particu-lar elements in critical applications shall be as agreed uponbetween the supplier and the purchaser.6.4 Fluorine and chlorine may be important impuritie
10、s insome applications.Acceptable limits and analytical techniquesshall be agreed upon between the supplier and the purchaser.7.Grain Size7.1 Grain size and measurement method for grain size shallbe agreed upon between the supplier and the purchaser.8.Dimensions8.1 Each product shall conform to an ap
11、propriate engineer-ing drawing,as agreed upon between the supplier and thepurchaser.8.2 Nominal dimensions,tolerances,and other attributesshall be agreed upon between the supplier and the purchaser.1This specification is under the jurisdiction of ASTM Committee F01 onElectronics and is the direct re
12、sponsibility of Subcommittee F01.17 on SputterMetallization.Current edition approved June 1,2011.Published June 2011.Originallypublished in 1994.Last previous edition approved in 2003 as F151394(2003).DOI:10.1520/F1513-99R11.2For referenced ASTM standards,visit the ASTM website,www.astm.org,orcontac
13、t ASTM Customer Service at serviceastm.org.For Annual Book of ASTMStandards volume information,refer to the standards Document Summary page onthe ASTM website.Copyright ASTM International,100 Barr Harbor Drive,PO Box C700,West Conshohocken,PA 19428-2959.United States1 9.Workmanship,Finish,and Appear
14、ance9.1 Workmanship,finish,and appearance shall be agreedupon between the supplier and the purchaser.9.2 Surface must be free of any contaminates such as moldrelease,dirt,or oils that could adversely effect the purity of thematerial when remelted,unless otherwise agreed upon betweensupplier and purc
15、haser.10.Sampling10.1 Analyses for impurities shall be performed on asamples that are representative of the suppliers finishedmaterial lots.11.Analytical Methods11.1 Analysis for impurities in 6.2 and Table 2 shall beperformed as follows:11.1.1 Alkalies(Potassium,Lithium,Sodium)Atomic ab-sorption(AA
16、),glow discharge mass spectrometer(GDMS)orany other technique with a minimum detection limit(mdl)of0.05 wt.ppm.Use Practices D1971,as applicable,for samplepreparation.11.1.2 Carbon,Oxygen,and SulfurFusion and gasextraction/infrared spectroscopy or GDMS;mdl 10 wt.ppm.11.1.3 NitrogenFusion and gas extraction/thermal con-ductivity analysis;mdl 5 wt.ppm.11.1.4 HydrogenFusion and gas extraction/thermal con-ductivity;mdl 0.3 wt.ppm.11.1.5 All OthersAA,inductively coupled plasma(ICP)emission spectrosco