1、Designation:F1612(Reapproved 2017)Standard Test Methods forMeasuring Diameter or Thickness of Wire and Ribbon forElectronic Devices and Lamps1This standard is issued under the fixed designation F16;the number immediately following the designation indicates the year of originaladoption or,in the case
2、 of revision,the year of last revision.Anumber in parentheses indicates the year of last reapproval.Asuperscriptepsilon()indicates an editorial change since the last revision or reapproval.1.Scope1.1 These test methods cover procedures for measuring thediameter or thickness of round and flat wire(ri
3、bbon)0.060 in.(1.52 mm)maximum used in electronic devices and lamps.1.2 The values stated in inch-pound units are to be regardedas standard.The values given in parentheses are mathematicalconversions to SI units that are provided for information onlyand are not considered standard.1.3 This standard
4、does not purport to address all of thesafety concerns,if any,associated with its use.It is theresponsibility of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.1.4 This international standard was
5、developed in accor-dance with internationally recognized principles on standard-ization established in the Decision on Principles for theDevelopment of International Standards,Guides and Recom-mendations issued by the World Trade Organization TechnicalBarriers to Trade(TBT)Committee.2.Summary of Tes
6、t Method2.1 In order to provide reliable determinations of physicaldimensions of wire and ribbon products,these test methods aredesigned to mechanically measure the diameter or thicknesswith a high degree of precision.These test methods are basedon the use of a sensitive measuring head with calibrat
7、edpressure settings,shaped measuring anvils to reduce errorscaused by material curvature or waviness,and a method forpresetting the anvil spacing by means of gage blocks orcylindrical master standards.3.Significance and Use3.1 The methods contained in this standard are intendedprimarily for referee
8、use,for laboratory measuring,and forcertifying size of standard samples used for checking othermeasuring equipment that may be agreed upon between thesupplier and the purchaser.4.Apparatus4.1 Either of two general types of apparatus may be used formeasuring,depending on the accuracy desired and on t
9、heavailability of certified cylindrical master standards for gagesetting,as follows:4.1.1 Apparatus A For use with cylindrical master stan-dards for gage setting.4.1.2 Apparatus B For use with gage block standards forgage setting.4.2 Apparatus A,shown in Fig.1,shall have the followingfeatures:4.2.1
10、An adjustable anvil of the size and shape specified forthe material to be inspected.The anvil shall be nonrotating andshall be adjustable for position by means of a micrometer orprecision adjusting screw,with means for locking the anvil inany set position after adjustments have been made.4.2.2 A sen
11、sing anvil of the size and shape specified for thematerial to be measured,linked directly to a sensing andindicating device of specified precision and sensitivity.4.2.3 The adjustable fixed anvil and sensing anvil and thesensing device shall be rigidly mounted with both anvils inalignment on the sam
12、e axis.The sensing anvil shall be movablewith provisions for retracting the anvil for placing the speci-men in the measuring position.4.2.4 Both anvils shall be properly fitted,lapped,andpolished so the contacting surfaces are flat and parallel withinthe accuracy specified.4.2.5 The sensing device s
13、hall be provided with a means forsetting the indicator hand or scale to zero,and a calibratedscale or dial for setting the sensing anvil measuring pressure tothe specified value required for measuring.This setting shall beaccurate to within6 10%of the set value.4.3 Apparatus B,shown in Fig.2,shall m
14、eet the require-ments specified for Apparatus A in 4.2 with the followingadditional features:4.3.1 The fixed anvil and support to which it is attachedshall be free to move along the measuring axis but shall be heldin line with the sensing anvil by means of cantilever springs sothat parallelism with
15、the sensing anvil is maintained.The1These test methods are under the jurisdiction of ASTM Committee F01 onElectronics and are the direct responsibility of Subcommittee F01.03 on MetallicMaterials,Wire Bonding,and Flip Chip.Current edition approved June 1,2017.Published June 2017.Originallypublished
16、in 1961 as F16 61 T.Last previous edition approved in 2012 as F16 12.DOI:10.1520/F0016-12R17.Copyright ASTM International,100 Barr Harbor Drive,PO Box C700,West Conshohocken,PA 19428-2959.United StatesThis international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for theDevelopment of International Standards,Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade