1、 IEC 61190-1-2 Edition 3.0 2014-02 INTERNATIONAL STANDARD NORME INTERNATIONALE Attachment materials for electronic assembly Part 1-2:Requirements for soldering pastes for high-quality interconnects in electronics assembly Matriaux de fixation pour les assemblages lectroniques Partie 1-2:Exigences re
2、latives aux ptes braser pour les interconnexions de haute qualit dans les assemblages de composants lectroniques IEC 61190-1-2:2014-02(en-fr)colourinsideCopyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,downloaded on Nov-27-2014 by James Madison.No further reproduction or
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