1、 CEI 60749-8(Premire dition 2002)DISPOSITIFS SEMICONDUCTEURS MTHODES DESSAIS MCANIQUESET CLIMATIQUES Partie 8:EtanchitIEC 60749-8(First edition 2002)SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 8:SealingC O R R I G E N D U M 2Page 6Au lieu de:Le comit a dcid que le contenu decette
2、 publication ne sera pas modifiavant 2012.lire:Le comit a dcid que le contenu decette publication ne sera pas modifiavant 2007.Page 7Instead of:The committee has decided that thecontents of this publication will remainunchanged until 2012.read:The committee has decided that thecontents of this publication will remainunchanged until 2007.Aot 2003August 2003