1、 IEC 62047-26 Edit ion1.0 2016-01 INTERNA TIONAL STA NDA RD NORME INTERNA TIONALE Semiconductor dev ices Micro-electromechanical dev ices Part 26:Description and measurement methods for micro trench and needle structures Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 26:Descript
2、ion et mthodes de mesure pour structures de microtranches et de microaiguille IEC 62047-26:2016-01(en-fr)colourinsideCopyright International Electrotechnical Commission THIS PUBLICA TION IS COPYRIGHT PROTECTED Copyright 2016 IEC,Geneva,Switzerland All rights reserved.Unless otherwise specified,no pa
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