1、 IEC TR 61760-3-1 Edition 1.0 2022-06 TECHNICAL REPORT Surface mounting technology Part 3-1:Standard method for the specification of components for through hole reflow(THR)soldering Guidelines for through hole diameter design with solder paste surface printing method IEC TR 61760-3-1:2022-06(en)colo
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9、300 terminological entries in English and French,with equivalent terms in 19 additional languages.Also known as the International Electrotechnical Vocabulary(IEV)online.IEC TR 61760-3-1 Edition 1.0 2022-06 TECHNICAL REPORT Surface mounting technology Part 3-1:Standard method for the specification of
10、 components for through hole reflow(THR)soldering Guidelines for through hole diameter design with solder paste surface printing method INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 31.190 ISBN 978-2-8322-3928-5 Registered trademark of the International Electrotechnical Commission Warning!Make sure
11、that you obtained this publication from an authorized distributor.colourinside 2 IEC TR 61760-3-1:2022 IEC 2022 CONTENTS FOREWORD.4 1 Scope.6 2 Normative references.6 3 Terms and definitions.6 4 Solder paste application methods.6 4.1 General.6 4.2 Through hole filled method.8 4.2.1 Overview.8 4.2.2
12、Advantages.9 4.2.3 Disadvantages.9 4.3 Solder paste surface printing method.9 4.3.1 Overview.9 4.3.2 Advantages.9 4.3.3 Disadvantages.9 5 Solder paste printing stencil aperture design guidelines.10 5.1 General.10 5.2 Amount of solder paste.10 5.2.1 Needed amount of solder paste.10 5.2.2 Printing vol
13、ume of solder paste.11 5.2.3 Designing amount of printing solder paste.13 6 Influence of terminal position tolerance on through hole diameter and stencil aperture design guidelines.13 6.1 Terminal position tolerance.13 6.2 Relationship between terminal position tolerance and through hole diameter.14
14、 6.2.1 General.14 6.2.2 Terminal position tolerance of 0,40 mm.14 6.2.3 Terminal position tolerance of 0,30 mm.15 6.2.4 Terminal position tolerance of 0,20 mm.15 6.3 Circuit board though hole diameter design guidelines for THR components.16 6.3.1 Circuit board though hole diameter design.16 6.3.2 Re
15、lationship through hole diameter and solder paste supply.17 Annex A(informative)Calculation method for solder fillet volume of the round terminal.21 Annex B(informative)Calculation method for metal volume of the printed solder paste.24 Bibliography.26 Figure 1 Solder paste application method.7 Figur
16、e 2 Through hole filled method(bottom side view).8 Figure 3 Solder paste fallen inside the reflow oven(through hole filled method).8 Figure 4 Solder paste state of solder paste surface printing method.8 Figure 5 Conceptual view of solder wetting of component terminals after reflow soldering.10 Figure 6 Single area printing.12 Figure 7 Slit printing.13 Figure 8 Terminal position tolerance 0,40 mm,through hole diameter 1,40 mm(one side clearance 0,20 mm).14 IEC TR 61760-3-1:2022 IEC 2022 3 Figure