1、第 52 卷 第 6 期 表面技术 2023 年 6 月 SURFACE TECHNOLOGY 351 收稿日期：20220629；修订日期：20221227 Received：2022-06-29；Revised：2022-12-27 基金项目：国家自然科学基金联合基金（U20A20293）Fund：The National Natural Science Foundation of China(U20A20293)作者简介：牛凤丽（1990），女，博士研究生。Biography：NIU Feng-li(1990-),Female,Doctoral candidate.通讯作者：朱永伟（19
2、67），男，博士。Corresponding author：ZHU Yong-wei(1967-),Male,Doctor.引文格式：牛凤丽,王科荣,任闯,等.金刚石一次粒径对固结聚集体金刚石磨料垫加工性能与磨损过程的影响J.表面技术,2023,52(6):351-360.NIU Feng-li,WANG Ke-rong,REN Chuang,et al.Effect of Primary Diamond Grain Size on Lapping Performance and Wear Process of Fixed Agglomerated Diamond Abrasive PadsJ
3、.Surface Technology,2023,52(6):351-360.金刚石一次粒径对固结聚集体金刚石磨料垫 加工性能与磨损过程的影响 牛凤丽1，王科荣1,2，任闯1，刘宁1，朱楠楠1，朱永伟1（1.南京航空航天大学 a 机电学院 b 江苏省精密与微细制造技术重点实验室，南京 210016；2.金华职业技术学院 机电工程学院，浙江 金华 321000）摘要：目的目的 探究金刚石颗粒的一次粒径对固结聚集体金刚石磨料垫磨损的影响规律，提高固结磨料垫的自修整、加工性能及经济耐用度。方法方法 选择 14、8、5、1 m 等 4 种粒度的金刚石颗粒，采用烧结法制备聚集体金刚石磨料，并将其用于制备
4、固结聚集体金刚石磨料垫。在 CP-4 抛光测试系统平台上开展研磨试验，在线获取加工过程中的力信号和摩擦因数。对比 4 种粒径的固结聚集体金刚石磨料垫的磨损速率、研磨比、研磨前后磨料垫的微观形貌、碎屑的形貌及尺寸分布，分析固结磨料垫的磨损过程及其演变规律。结果结果 随着金刚石颗粒粒径的增大，固结聚集体金刚石磨料垫的磨损速率由 0.2 m/min（金刚石颗粒为 1 m）增加到 3.5 m/min（金刚石颗粒为 14 m），研磨比由 2.02 增加至 14.33。大粒径（5 m）的固结磨料垫研磨后，表面仍有锋利的金刚石微切削刃，研磨过程中的切向力和摩擦因素保持稳定，固结聚集体金刚石磨料垫的磨损形式以
5、金刚石颗粒的脱落为主；超细粒径（1 m）固结磨料垫表面的金刚石颗粒出现堵塞现象，并且研磨过程中的切向力和摩擦因数持续下降。结论结论 随着金刚石颗粒的一次粒径增大，固结聚集体金刚石磨料垫的磨损速率增加，自修整能力、材料去除能力和加工过程稳定性得到提升，进入稳定磨损期的时间缩短。关键词：一次粒径；聚集体金刚石磨料；固结磨料垫；磨损速率；磨损机制 中图分类号：TG73；TG74 文献标识码：A 文章编号：1001-3660(2023)06-0351-10 DOI：10.16490/ki.issn.1001-3660.2023.06.031 Effect of Primary Diamond Grai
6、n Size on Lapping Performance and Wear Process of Fixed Agglomerated Diamond Abrasive Pads NIU Feng-li1,WANG Ke-rong1,2,REN Chuang1,LIU Ning1,ZHU Nan-nan1,ZHU Yong-wei1(1.a.College of Mechanical and Electrical Engineering,b.Jiangsu Key Laboratory of Precision and Micro-manufacturing Technology,Nanji
7、ng University of Aeronautics and Astronautics,Nanjing 210016,China;2.Mechanical&Electrical Engineering College,Jinhua Polytechnic,Zhejiang Jinhua 321000,China)352 表 面 技 术 2023 年 6 月 ABSTRACT:Fixed abrasive lapping,with the advantages of high material removal rate,excellent processed surface quality,
8、and green environmental protection,is widely used in the lapping and polishing processing of semiconductor materials and optical glass,like SiC,GaN,sapphire,AlN,BK7 glass,fused silica glass,etc.For Fixed Abrasives(FA)Pads,as the lapping tools,its wear modes and wear process mechanism determine the s
9、tability of lapping process.Diamond grain sizes directly affect the lapping performance and wear behaviors.The work aims to investigate the effect of the primary diamond grain size on the wear mechanism of Fixed Agglomerated Diamond Abrasive(FADA)pads,and to improve the self-conditioning,lapping pro
10、cess stability and economic durability of the pads.The diamond grains with four sizes of 14 m,8 m,5 m,1 m,were selected to prepare the agglomerated diamond(AD)abrasives by sintering method.The four types of AD abrasives were used to prepare the hydrophilic resin-based FADA pads on the platen vulcani
11、zer.The lapping tests were carried out on the CP-4 polishing platform which acquired lapping forces and friction factors during lapping process and coordinates of workpiece in Z direction.BK7 glass was selected as the workpiece with the diameter of 76.2 mm and the thickness of 5 mm.The wear rates an
12、d lapping ratios of FADA pads were calculated,the morphologies of pads before and after lapping were observed by a scanning electron microscope,and the size distribution of debris was detected by BT-2800 Dynamic Image Particle Size Analysis System.The wear process(wear thickness of pads vs material
13、removal thickness of BK7 glass)of FADA pads was analyzed.The experimental results indicated that the wear rate of FADA pads increased from 0.2 m/min to 3.5 m/min when the primary diamond grain size increased from 1 m to 14 m.From the morphologies of FADA pads before and after lapping,the surface of
14、FADA pads after lapping still had sharp micro-cutting-edges when the diamond grain size was above 5 m.The main wear mode was the fallen diamond grains off the surface of FADA pads according to the SEM of debris and its size distributions.However,for the diamond grain size below 1 m of FADA pads,the
15、clogged diamond grains and some scratches by debris were found on the surface of FADA pads.With the increasing diamond grain size,the values of tangential force Ft and friction factor f increased.During the whole lapping process,Ft and f more and more stable except under the condition of diamond gra
16、in size below 1 m.The wear process of FADA pads consisted of three stages,namely initial rapid wear(I),stable wear(II),and severe wear(III).For the diamond grains above 5 m,the wear process of three FADA pads gone through the stages of I and II.Under the same material removal thickness,the larger size the diamond grains were,the smaller the wear thickness of FADA pads was and the more stable the wear processes were.However,for diamond grains below 1 m,the FADA pad wear process gone from I to III