1、Designation:D430001(Reapproved 2013)Standard Test Methods forAbility of Adhesive Films to Support or Resist the Growth ofFungi1This standard is issued under the fixed designation D4300;the number immediately following the designation indicates the year oforiginal adoption or,in the case of revision,
2、the year of last revision.A number in parentheses indicates the year of last reapproval.Asuperscript epsilon()indicates an editorial change since the last revision or reapproval.This standard has been approved for use by agencies of the U.S.Department of Defense.1.Scope1.1 These test methods test th
3、e ability of adhesive films toinhibit or support the growth of selected fungal speciesgrowing on agar plates by providing means of testing the filmson two agar substrates,one which promotes microbial growth,and one which does not.1.2 These test methods are not appropriate for all adhesives.The activ
4、ity of certain biocides may not be demonstrated bythese test methods as a result of irreversible reaction with someof the medium constituents.NOTE1As an example,quaternary ammonium compounds areinactivated by agar.1.3 A test method is included for use with low-viscosityadhesives along with an altern
5、ative method for use withmastic-type adhesives.Also,a method approved by the gov-ernment is given.1.4 The values stated in SI units are to be regarded as thestandard.The values given in parentheses are for informationonly.1.5 This standard does not purport to address all of thesafety concerns,if any
6、,associated with its use.It is theresponsibility of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.These test methodsare designed to be used by persons trained in correct micro-biological techniq
7、ues.Specific precautionary statements aregiven in Section 7 and in 14.3.2.2.Referenced Documents2.1 ASTM Standards:2D907 Terminology of AdhesivesD1286 Method of Test for Effect of Mold Contamination onPermanence of Adhesives Preparations and AdhesivesBonds(Withdrawn 1983)3G21 Practice for Determinin
8、g Resistance of Synthetic Poly-meric Materials to Fungi2.2 TAPPI Method:T487 Fungus Resistance for Paper and Paperboard43.Terminology3.1 DefinitionsMany terms in this test method are definedin Terminology D907.3.2 Definitions of Terms Specific to This Standard:3.2.1 adhesive preparation,nthe adhesiv
9、e as packaged fordistribution,storage,and use.3.2.2 adhesive film,nthe small portion of the adhesivepreparation,as prepared for use by the consumer,either withadditives or as received,which is cast on a substrate,cured 24h,and represents the glue line.3.2.2.1 DiscussionFor purposes of these test met
10、hods theadhesive film is the thin layer of adhesive spread on either the21-mm fiberglass disk as described in 14.2,or the adhesivelayer 3 mm thick which is cast on the tile squares as describedin 15.1.3.2.3 zone of inhibition,nthe area on an inoculated agarplate surrounding the adhesive-coated disk
11、or tile,showing areduced fungal growth or an absence thereof.3.3 Abbreviations:3.3.1 PDApotato dextrose agar.3.3.2 MSAmineral salts agar.3.3.3 ZIzone of inhibition.4.Significance and Use4.1 These test methods are designed to be used to determinethe susceptibility of the adhesive film to biodegradati
12、on andwhether the adhesive will carry into the bond line sufficient1These test methods are under the jurisdiction of ASTM Committee D14 onAdhesives and are the direct responsibility of Subcommittee D14.30 on WoodAdhesives.Current edition approved Oct.1,2013.Published October 2013.Originallyapproved
13、in 1983.Last previous edition approved in 2008 as D4300 01(2008).DOI:10.1520/D4300-01R13.2For referenced ASTM standards,visit the ASTM website,www.astm.org,orcontact ASTM Customer Service at serviceastm.org.For Annual Book of ASTMStandards volume information,refer to the standards Document Summary p
14、age onthe ASTM website.3The last approved version of this historical standard is referenced onwww.astm.org.4Available from Technical Association of the Pulp and Paper Industry(TAPPI),15 Technology Parkway South,Norcross,GA 30092,http:/www.tappi.org.Copyright ASTM International,100 Barr Harbor Drive,
15、PO Box C700,West Conshohocken,PA 19428-2959.United States1 anti-fungal properties to prevent growth of fungi frequentlypresent on the gluing equipment,on adherends,or in theadhesive as applied.4.2 Potato dextrose agar(PDA)provides a complete me-dium for the growth of fungi,while mineral salts agar(M
16、SA)lacks a carbohydrate source and provides a less favorablemedium.Use of PDA tests the adhesive film for its ability toresist the growth of fungi on its surface as well as its ability torepel a copious growth of fungi on the adjacent agar surface.Use of MSA tests the adhesive film primarily for its ability toresist the growth of fungi on its surface.When it is used,thereis a reduced possibility that the growth from the agar will bemis-read as coming from the adhesive film,since fungalgrowth on
