1、Designation:F139693(Reapproved 2012)Standard Test Method forDetermination of Oxygen Contribution by Gas DistributionSystem Components1This standard is issued under the fixed designation F1396;the number immediately following the designation indicates the year oforiginal adoption or,in the case of re
2、vision,the year of last revision.A number in parentheses indicates the year of last reapproval.Asuperscript epsilon()indicates an editorial change since the last revision or reapproval.INTRODUCTIONSemiconductor clean rooms are serviced by high-purity gas distribution systems.This test methodpresents
3、 a procedure that may be applied for the evaluation of one or more components considered foruse in such systems.1.Scope1.1 This test method covers a procedure for testing compo-nents for oxygen contribution to ultra-high purity gas distribu-tion systems at ambient temperature.In addition,this testme
4、thod allows testing of the component at elevated ambienttemperatures as high as 70C.1.2 This test method applies to in-line components contain-ing electronics grade materials such as those used in asemiconductor gas distribution system.1.3 Limitations:1.3.1 This test method is limited by the sensiti
5、vity of currentinstrumentation,as well as the response time of the instrumen-tation.This test method is not intended to be used for testcomponents larger than 12.7-mm(12-in.)outside diameternominal size.This test method could be applied to largercomponents;however,the stated volumetric flow rate may
6、 notprovide adequate mixing to ensure a representative sample.Higher flow rates may improve the mixing but excessivelydilute the sample.1.3.2 This test method is written with the assumption thatthe operator understands the use of the apparatus at a levelequivalent to six months of experience.1.4 The
7、 values stated in SI units are to be regarded as thestandard.The inch-pound units given in parentheses are forinformation only.1.5 This standard does not purport to address all of thesafety concerns,if any,associated with its use.It is theresponsibility of the user of this standard to establish appr
8、o-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.Specific hazardstatements are given in Section 6.2.Terminology2.1 Definitions:2.1.1 baselinethe instrument response under steady stateconditions.2.1.2glove bagan enclosure that contains a con
9、trolledatmosphere.A glove box could also be used for this testmethod.2.1.3 heat trace heating of a component,spool piece,ortest stand by a uniform and complete wrapping of the item withresistant heat tape.2.1.4 minimum detection limit(MDL)of the instrumentthelowest instrument response detectable and
10、 readable by theinstrument,and at least two times the amplitude of the noise.2.1.5 response timethe time required for the system toreach steady state after a change in concentration.2.1.6spool piecea null component,consisting of astraight piece of electropolished tubing and appropriate fittings,used
11、 in place of the test component to establish the baseline.2.1.7 standard conditions101.3 kPa,0.0C(14.73 psia,32F).2.1.8 test componentany device being tested,such as avalve,regulator,or filter.2.1.9 test standthe physical test system used to measureimpurity levels.2.1.10 zero gasa purified gas that
12、has an impurity concen-tration below the MDL of the analytical instrument.This gas isto be used for both instrument calibration and componenttesting.2.2 Symbols:2.2.1 P1The inlet pressure measured upstream of thepurifier and filter in the test apparatus.1This test method is under the jurisdiction of
13、 ASTM Committee F01 onElectronicsand is the direct responsibility of Subcommittee F01.10 on Contamina-tion Control.Current edition approved July 1,2012.Published August 2012.Originallyapproved in 1992.Last previous edition approved in 2005 as F1396 93(2005).DOI:10.1520/F1396-93R12.Copyright ASTM Int
14、ernational,100 Barr Harbor Drive,PO Box C700,West Conshohocken,PA 19428-2959.United States1 2.2.2 P2The outlet pressure measured downstream of theanalyzer in the test apparatus.2.2.3 ppbvParts per billion by volume assuming ideal gasbehavior,equivalent to nmole/mole(such as nL/L).The sameas molar pa
15、rts per billion(ppb).2.2.4 ppbwParts per billion by weight(such as ng/g).2.2.5ppmvParts per million by volume assuming idealgas behavior,equivalent to mole/mole(such as L/L).Thesame as molar parts per million(ppm).2.2.6ppmwParts per million by weight(such as g/g).2.2.7 Q1the bypass sample flow not g
16、oing through theanalytical system.2.2.8 Q2the total sample flow through the analyticalsystem.2.2.9 Qsthe flow through the spool piece or component.2.2.10 Tathe temperature of the air discharged by theanalyzers cooling exhaust.2.2.11 Tsthe temperature of the spool piece or component.2.2.11.1 DiscussionPrecautions must be taken to insurethat the temperature measured by the thermocouple is as closeas possible to that of the spool piece and test component.Appropriate insulation and conductive shield
