1、Designation:F136798(Reapproved 2011)Standard Specification forChromium Sputtering Targets for Thin Film Applications1This standard is issued under the fixed designation F1367;the number immediately following the designation indicates the year oforiginal adoption or,in the case of revision,the year o
2、f last revision.A number in parentheses indicates the year of last reapproval.Asuperscript epsilon()indicates an editorial change since the last revision or reapproval.1.Scope1.1 This specification covers sputtering targets fabricatedfrom chromium metal.1.2 This specification sets purity grade level
3、s,physicalattributes,analytical methods and packaging requirements.1.3 The values stated in SI units are to be regarded asstandard.No other units of measurement are included in thisstandard.2.Referenced Documents2.1 ASTM Standards:2E112 Test Methods for Determining Average Grain Size3.Terminology3.1
4、 Definitions of Terms Specific to This Standard:3.1.1 raw material lotoriginal material lot from which anumber of targets is fabricated.3.1.2 relative density,nactual target density divided by thetheoretical density of chromium,7.21 g/cm2.4.Classification4.1 Grades of chromium are defined in Table 1
5、.4.2 Grade,as defined in Table 1,is based on the totalmetallic impurity content of the metallic elements listed inTable 2.Elements not detected shall be counted and reported aspresent at the detection limit.5.Ordering Information5.1 Orders for these targets shall include the following:5.1.1 Grade,5.
6、1.2 Configuration,(see 8.1 and 8.2),5.1.3 Whether certification is required,(see 12.1),and5.1.4 Whether a sample representative of the finished prod-uct is required to be provided by the supplier to the purchaser.6.Chemical Composition6.1 The metallic elements listed in Table 2 shall be assayedand r
7、eported.6.2 Gaseous elements to be assayed and reported are C,O,N and S.6.3 Other elements may be assayed and reported as agreedupon between the purchaser and the supplier,but these shallnot be counted in determining the grade designation.6.3.1 Acceptable limits and analytical techniques for addi-ti
8、onal elements shall be agreed upon between the purchaser andthe supplier.7.Physical Properties7.1 Minimum relative density shall be agreed upon by thepurchaser and the supplier.7.2 Actual target density shall be determined byArchimedesprinciple or other acceptable techniques.7.3 Grain size shall be
9、agreed upon between the purchaserand the supplier,and reported in accordance with Test MethodE112.8.Dimensions,Mass,and Permissible Variations8.1 Each target shall conform to an appropriate engineeringdrawing.8.2 Nominal dimensions,tolerances and other attributesshall be agreed upon between purchase
10、r and supplier.9.Workmanship,Finish and Appearance9.1 Workmanship,finish and appearance shall be agreedupon between the purchaser and the supplier.10.Sampling10.1 Analyses for impurities shall be performed on a samplethat is representative of the finished product.10.2 Reporting analytical results of
11、 the unprocessed rawmaterial lot is not acceptable.11.Analytical Methods11.1 Analysis for impurities in Table 2 and 6.2 shall beperformed as follows:1This specification is under the jurisdiction of ASTM Committee F01 onElectronics and is the direct responsibility of Subcommittee F01.17 on SputterMet
12、allization.Current edition approved June 1,2011.Published June 2011.Originallyapproved in 1992.Last previous edition approved in 2003 as F1367-98(2003).DOI:10.1520/F1367-98R11.2For referenced ASTM standards,visit the ASTM website,www.astm.org,orcontact ASTM Customer Service at serviceastm.org.For An
13、nual Book of ASTMStandards volume information,refer to the standards Document Summary page onthe ASTM website.Copyright ASTM International,100 Barr Harbor Drive,PO Box C700,West Conshohocken,PA 19428-2959.United States1 11.1.1 Carbon,Oxygen and SulfurCombustion/infraredspectrometry,mdl of 10 ppm,or
14、less.11.1.2 NitrogenThermal conductivity spectrometry,mdlof 10 ppm,or less.11.1.3 All OthersAA,direct current plasma(DCP),induc-tively coupled plasma(ICP),spark source mass spectroscopy(SSMS)or glow discharge mass spectroscopy(GDMS),mdl of5 ppm,or less.11.1.4 Other analytical techniques may be used
15、providedthey can be proved equivalent to the methods specified,andhave minimum detection limits of the specified methods.12.Certification12.1 When required by the purchaser,a certificate of analy-sis that represents the finished material lot shall be provided foreach target.12.2 Certificate of analy
16、sis shall state the manufacturers orsuppliers name,the suppliers lot number,impurity levels,method of analysis,and any other information agreed uponbetween the purchaser and the supplier.12.3 Impurity levels may be reported on a certificate ofanalysis using actual analytical results,or typical results basedupon historical statistical data for the same process,as agreedupon between the purchaser and the supplier.The minimumdetection limit for each element listed in Table 2 that was notdetected in
