1、Designation:F126913Standard Test Methods forDestructive Shear Testing of Ball Bonds1This standard is issued under the fixed designation F1269;the number immediately following the designation indicates the year oforiginal adoption or,in the case of revision,the year of last revision.A number in paren
2、theses indicates the year of last reapproval.Asuperscript epsilon()indicates an editorial change since the last revision or reapproval.1.Scope1.1 These test methods cover tests to determine the shearstrength of a series of ball bonds made by either thermosonicor thermal compression techniques using
3、either gold or copperwires.NOTE1Common usage at the present time considers the term“ballbond to include the enlarged spheriodal or nailhead portion of the wire,(produced by the flameoff/spark EFO and first bonding operation in thethermosonic or thermal compression process),and the ball bond-bonding
4、pad interfacial-attachment area or weld interface.1.2 These test methods cover ball bonds made with smalldiameter(from 18 to 76-m(0.0007 to 0.003-in.)gold orcopper wire of the type used in integrated circuits and hybridmicroelectronic assemblies,system on a chip,and so forth.1.3 These test methods c
5、an be used only when the ballheight and diameter are large enough and adjacent interferingstructures are far enough away to allow suitable placement andclearance(above the bonding pad and between adjacent bonds)of the shear test ram.1.4 These test methods are destructive.They are appropriatefor use
6、in process development or,with a proper sampling plan,for process control or quality assurance.1.5 The values stated in SI units are to be regarded as thestandard.The values given in parentheses are for informationonly.1.6 This standard does not purport to address all of thesafety concerns,if any,as
7、sociated with its use.It is theresponsibility of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.2.Referenced Documents2.1 ASTM Standards:2F458 Practice for Nondestructive Pull Testing of Wire Bon
8、dsF459 Test Methods for Measuring Pull Strength of Micro-electronic Wire Bonds2.2 NIST Documents:3NBS Handbook 105-1 Specification and Tolerances for Ref-erence Standards and Field Standards,Weights and Mea-suresIOLM Class M2-Circular 547-1 Precision Laboratory Stan-dards of Mass and Laboratory Weig
9、hts2.3 Military Standard:4MIL-STD 883,Method 20103.Terminology3.1 Definitions of Terms Specific to This Standard:3.1.1 ball lifta separation of the ball bond at the bondingpad interface with little or no residual(less than 25%of thebond deformation area)ball metallization remaining on thebonding pad
10、(that remains essentially intact).In the case ofgold ball bonds on aluminum pad metallization,a ball lift isdefined as a separation of the ball bond at the bonding padinterface with little or no intermetallic formation either presentor remaining(area of intermetallic less than 25%of the bonddeformat
11、ion area).3.1.1.1 DiscussionIntermetallic refers to the aluminumgold alloy formed at the ball bond pad metallization interfacialarea where a gold ball bond is attached to an aluminum padmetallization.If the wire/ball is of copper,then the aluminumintermetallic is normally much thinner and may not be
12、 opti-cally observable.3.1.2 ball shear(weld interface separation)an appre-ciable intermetallic(in the case of the aluminum-gold system)and ball metallization,or both,(in the case of the gold-to-goldsystem)remains on the bonding pad(area of remaining metalor intermetallic greater than 25%of the bond
13、 deformationarea).3.1.3 bonding pad lift(substrate metallization removal)aseparation between the bonding pad and the underlying sub-strate.The interface between the ball bond and the residual padmetallization attached to the ball remains intact.1These test methods are under the jurisdiction of ASTM
14、Committee F01 onElectronics and is the direct responsibility of Subcommittee F01.03 on MetallicMaterials,Wire Bonding,and Flip Chip.Current edition approved Jan.1,2013.Published January 2013.Originallyapproved in 1989.Last previous edition approved in 2006 as F126906.DOI:10.1520/F1269-13.2For refere
15、nced ASTM standards,visit the ASTM website,www.astm.org,orcontact ASTM Customer Service at serviceastm.org.For Annual Book of ASTMStandards volume information,refer to the standards Document Summary page onthe ASTM website.3Available from the National Technical Information Service,5285 Port RoyalRd.
16、,Springfield,VA 22161.4Available from Standardization Documents Order Desk,Bldg.4 Section D,700Robbins Ave.,Philadelphia,PA 19111-5094,Attn:NPODS.Copyright ASTM International,100 Barr Harbor Drive,PO Box C700,West Conshohocken,PA 19428-2959.United States1 3.1.4 crateringbonding pad lifts taking a portion of theunderlying substrate material with it.Residual pad and sub-strate material are attached to the ball.The interface betweenthe ball and this residual material remains intact.3.1.4.1 Discussi
