1、 ADHESION MEASUREMENT OF THIN FILMS,THICK FI LMS,AN D BULK COATINGS A symposium presented at ASTM Headquarters AMERICAN SOCIETY FOR TESTING AND MATERIALS Philadelphia,Pa.,2-4 Nov.1976 ASTM SPECIAL TECHNICAL PUBLICATION 640 K.L.Mittal IBM Corporation East Fishkill Facility Hopewell Junction,N.Y.edito
2、r List price$39.25 04-640000.25 AMERICAN SOCIETY FOR TESTING AND MATERIALS 1916 Race Street,Philadelphia,Pa.19103 Copyright?9 BY AMERICAN SOCIETY FOR TESTING AND MATERIALS 1978 Library of Congress Catalog Card Number:77-84460 NOTE The Society is not responsible,as a body,for the statements and opini
3、ons advanced in this publication.Foreword The symposium on Adhesion Measurement of Thin Films,Thick Films,and Bulk Coatings was held at the headquarters of the American Society for Testing and Materials,Philadelphia,Pa.,2-4 Nov.1976.The ASTM Publications Committee sponsored the symposium.K.L.Mittal,
4、IBM Corporation,presided as symposium chairman and editor of this publication.Related ASTM Publications Spreading Resistance,STP 572(1975),$3.55,04-572000-46 Surface Analysis Techniques for Metallurgical Applications,STP 596(1976),$15.00,04-596000-28 Composite Materials:Testing and Design(Fourth Con
5、ference),STP 617(1974),$51.75,04-617000-33 A Note of Appreciation to Reviewers This publication is made possible by the authors and,also,the un-heralded efforts of the reviewers.This body of technical experts whose dedication,sacrifice of time and effort,and collective wisdom in review-ing the paper
6、s must be acknowledged.The quality level of ASTM publica-tions is a direct function of their respected opinions.On behalf of ASTM we acknowledge with appreciation their contribution.ASTM Committee on Publications Editorial Staff Jane B.Wheeler,Managing Editor Helen M.Hoersch,Associate Editor Ellen J
7、.McGlinchey,Senior Assistant Editor Sheila G.Pulver,Assistant Editor Contents Introduction 1 GENERAL PAPERS RELATED TO ADHESION MEASUREMENT Adhesion Measurement:Recent Progress,Unsolved Problems,and Pmspeets-K.L.MITTAL 5 Discussion 16 Locus of Failure and Its Implications for Adhesion Measurements-S
8、.J.GOOD 18 Discussion 27 Problems in Adhesion Measurement-j.j.BIKERMAN 30 Discussion 38 Experimental Methods to Determine Locus of Failure and Bond Failure Mechanism in Adhesive Joints and Coattng-Substrate Combinations-w.L.BAUN 41 Thin-Film Adhesion and Adhesive Failure-A Perspective-D.M.MATTOX 54
9、Discussion 62 Use of Fracture Mechanics Concepts in Testing of Film Adhesion-W.D.BASCOM,P.F.BECHER,J.L.BITNER,AND J.S.MURDAY 63 Discussion 79 Techniques for Measuring Adhesive Energies in Metal/Ceramic Systems-L.E.MURR 82 Discussion 97 ADHESION MEASUREMENT OF THIN FILMS Adhesion of Thin Plasma Polym
10、er Films to Plastics-L.W.CRANE AND C.L.HAMERMESH 101 Discussion 106 Electromagnetic Tensile Adhesion Test Method-soL KaONGELB 107 Discussion 120 Measurements of Film-Substrate Bond Strength by Laser Spallation-J.L.VOSSEN 122 Discussion 131 Hardness and Adhesion of Filmed Structures as Determined by
11、the Scratch Technique-J.AHN,K.L.MITTAL,AND R.H.MACQUEEN Discussion 134 156 Threshold Adhesion Failure:An Approach to Thin-Film Adhesion Measurement Using the Stylus Method-J.OROSHNIK AND W.K.CROLL Discussion 158 182 Adhesion of Granular Thin FilmS-ROLAND FAURE Discussion 184 197 Adhesion Measurement
12、 on Thin Evaporated Filmsw KAIZO KUWAHARA,HIDENORI HmOTA,AND NOBUO UMEMOTO 198 Discussion 207 ADHESION MEASUREMENT OF Track FILMS Adhesion Measurements on Thick-Film Conduetors-T.T.HITCH 211 Discussion 231 Adhesion of Thick Films to Ceramic and Its Measurement by Both Destructive and Nondestructive
13、Means-s.L.MOREY 233 Discussion 250 Evaluation of Methods for Performing Adhesion Measurements of Thick.Film Terminations on Chip Components-G.I.EWELL Discussion 251 267 Adhesion Measurement Technique for Soldered Thick-Film Conductors-s.s.LEVEN Discussion 269 283 Adhesion of Flame-Sprayed Coatings-H
14、.s.INGHAM,JR.285 Adherence Measurements and Evaluation of Thick-Film Platinum-Gold-s.SCHROTER 293 ADHESION MEASUREMENT OF DEPOSITS AND COATINGS Adhesion Testing of Deposit-Snbstrate Combinations-J.w.DINI AND H.R.JOHNSON Discussion 305 326 Methods for Evaluating Adhesion of Photoresist Materials to S
15、emiconductor Deviees-r A.DECKERT Discussion 327 341 Effect of Aspect Ratio on Tensile Bond Strength for Butt Joint of Internal Fracture-Theoretical and Experimental Analysis-MINEO MASUOKA AND KAZUMUNE NAKAO Discussion 342 359 Measuring the Temperature Dependence of the Strength of Metal-Polymer Joln
16、ts-N.I.EGORENKOV AND V.A.BELYI 362 Peel Test for Determlning the Adhesion of Electrodeposits on Metallic Substrates-o.J.KLINGENMAIER AND S.M.DOBRASH 369 Discussion 389 SUMMARY Summary 393 Index 399 STP640-EB/Jan.1978 Introduction This volume chronicles the proceedings of the Symposium on Adhesion Measurement of Thin Films,Thick Films,and Bulk Coatings,held under the auspices of the American Society for Testing and Materials,2-4,Nov.1976,in Philadelphia,Pa.Thin films(1#m),and bulk coatings(25#m)a
