1、INTERNATIONALSTANDARDIEC60191-6-6First edition2001-03Mechanical standardization of semiconductordevices Part 6-6:General rules for the preparation of outlinedrawings of surface mounted semiconductordevice packages Design guide for fine pitchland grid array(FLGA)Normalisation mcanique des dispositifs
2、 semi-conducteurs Partie 6-6:Rgles gnrales pour la prparation des dessinsdencombrement des dispositifs semiconducteurspour montage en surface Guide de conceptiondes dispositifs FLGAReference numberIEC 60191-6-6:2001(E)LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,
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9、3 00LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.INTERNATIONALSTANDARDIEC60191-6-6First edition2001-03Mechanical standardization of semiconductordevices Part 6-6:General rules for the preparation of outlinedrawings of surface mounte
10、d semiconductordevice packages Design guide for fine pitch land grid array(FLGA)Normalisation mcanique des dispositifs semi-conducteurs Partie 6-6:Rgles gnrales pour la prparation des dessinsdencombrement des dispositifs semiconducteurspour montage en surface Guide de conceptiondes dispositifs FLGAP
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13、Y BOOK SUPPLY BUREAU.2 60191-6-6 IEC:2001(E)INTERNATIONAL ELECTROTECHNICAL COMMISSION_MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-6:General rules for the preparation of outline drawingsof surface mounted semiconductor device packages Design guide for fine-pitch land grid array(FLGA)FO
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