1、INTERNATIONALSTANDARDIEC60191-6-4First edition2003-06Mechanical standardization ofsemiconductor devices Part 6-4:General rules for the preparation ofoutline drawings of surface mountedsemiconductor device packages Measuring methods for packagedimensions of ball grid array(BGA)Normalisation mcanique
2、des dispositifs semiconducteurs Partie 6-4:Rgles gnrales pour la prparation des dessinsdencombrement des dispositifs semiconducteurs montage en surface Mthodes de mesure pour les dimensions des botiersmatriciels billesReference numberIEC 60191-6-4:2003(E)LICENSED TO MECON Limited.-RANCHI/BANGALOREFO
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9、act the Customer Service Centre:Email:custserviec.chTel:+41 22 919 02 11Fax:+41 22 919 03 00LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.INTERNATIONALSTANDARDIEC60191-6-4First edition2003-06Mechanical standardization ofsemiconductor
10、 devices Part 6-4:General rules for the preparation ofoutline drawings of surface mountedsemiconductor device packages Measuring methods for packagedimensions of ball grid array(BGA)Normalisation mcanique des dispositifs semiconducteurs Partie 6-4:Rgles gnrales pour la prparation des dessinsdencombr
11、ement des dispositifs semiconducteurs montage en surface Mthodes de mesure pour les dimensions des botiersmatriciels billes IEC 2003 Copyright-all rights reservedNo part of this publication may be reproduced or utilized in any form or by any means,electronic ormechanical,including photocopying and m
12、icrofilm,without permission in writing from the publisher.International Electrotechnical Commission,3,rue de Varemb,PO Box 131,CH-1211 Geneva 20,SwitzerlandTelephone:+41 22 919 02 11 Telefax:+41 22 919 03 00 E-mail:inmailiec.ch Web:www.iec.chPFor price,see current cataloguePRICE CODECommission Elect
13、rotechnique InternationaleInternational Electrotechnical Commission LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 60191-6-4 IEC:2003(E)CONTENTSFOREWORD.31Scope.42Normative references.43Terms and definitions.44Reference character an
14、d drawings.54.1Ball grid array package(BGA)Type 1 Ball datum.54.2Ball grid array package(BGA)Type 2 Body datum.6Measuring method.75.1Datum S as pertaining to ball coplanarity.75.2Datum A,B.75.3Definition of specified dimensions and measuring method.95.4Profile of a package edge surface v.115.5Mounti
15、ng height A.125.6First stand-off A1.125.7Second stand-off A4.135.8Ball diameter b.145.9Ball centre position X.145.10 Ball coplanarity y.165.11 Package top flatness y1.16Figure 1 BGA package Type 1 Ball datum.5Figure 2 BGA package Type 2 Body datum.6Figure 3 Datum S.7Figure 4 Datum A,B Type 1.8Figure
16、 5 Centre of ball centres(for an even number).8Figure 6 Centre of ball centres(for an odd number).8Figure 7 Datum A Type 2.9Figure 8 Datum B Type 2.9Figure 9 Tolerance w.10Figure 10 Measuring method of tolerance w.10Figure 11 Profile of a package edge surface v.11Figure 12 Measuring method of package edge surface v.11Figure 13 Mounting height A.12Figure 14 First stand-off A1.12Figure 15 Measuring method of stand-off A1.13Figure 16 Second stand-off A4.13Figure 17 Measuring method of stand-off A4.
