1、INTERNATIONALSTANDARDIEC60191-6-8First edition2001-08Mechanical standardizationof semiconductor devices Part 6-8:General rules for the preparation of outlinedrawings of surface mounted semiconductordevice packages Design guide for glass sealed ceramic quadflatpack(G-QFP)Normalisation mcanique des di
2、spositifs semiconducteursPartie 6-8:Rgles gnrales pour la prparation des dessinsdencombrement des dispositifs semiconducteurs montage en surface Guide de conception pour les botiers plats quadrangulairesen cramique,scellement verreReference numberIEC 60191-6-8:2001(E)LICENSED TO MECON Limited.-RANCH
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9、custserviec.chTel:+41 22 919 02 11Fax:+41 22 919 03 00LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.INTERNATIONALSTANDARDIEC60191-6-8First edition2001-08Mechanical standardizationof semiconductor devices Part 6-8:General rules for th
10、e preparation of outlinedrawings of surface mounted semiconductordevice packages Design guide for glass sealed ceramic quadflatpack(G-QFP)Normalisation mcanique des dispositifs semiconducteursPartie 6-8:Rgles gnrales pour la prparation des dessinsdencombrement des dispositifs semiconducteurs montage
11、 en surface Guide de conception pour les botiers plats quadrangulairesen cramique,scellement verrePRICE CODE IEC 2001 Copyright-all rights reservedNo part of this publication may be reproduced or utilized in any form or by any means,electronic ormechanical,including photocopying and microfilm,withou
12、t permission in writing from the publisher.International Electrotechnical Commission3,rue de Varemb Geneva,SwitzerlandTelefax:+41 22 919 0300e-mail:inmailiec.ch IEC web site http:/www.iec.chKFor price,see current catalogue Commission Electrotechnique Internationale International Electrotechnical Com
13、missionLICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 60191-6-8 IEC:2001(E)INTERNATIONAL ELECTROTECHNICAL COMMISSION_MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-8:General rules for the preparation of outline drawingso
14、f surface mounted semiconductor device packages Design guide for glass sealed ceramic quad flatpack(G-QFP)FOREWORD1)The IEC(International Electrotechnical Commission)is a worldwide organization for standardization comprisingall national electrotechnical committees(IEC National Committees).The object
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