1、CEI 60191-6-2(Premire dition 2001)Normalisation mcanique des dispositifs semiconducteurs Partie 6-2:Rgles gnrales pour la prparation desdessins dencombrement des dispositifs semiconducteurs pour montage en surface Guidede conception pour les botiers broches en formede billes et de colonnes,avec des
2、pas de 1,50 mm,1,27 mm et 1,00 mmPublication monolingue(anglais)IEC 60191-6-2(First edition 2001)Mechanical standardization ofsemiconductor devices Part 6-2:General rules for the preparationof outline drawings of surface mountedsemiconductor device packages Designguide for 1,50 mm,1,27 mm and 1,00 m
3、mpitch ball and column terminal packagesC O R R I G E N D U M 1Pages 5 and 8Clause 4 and clause 5Reference characters and drawingsReplace the existing two figures by the following:1 2 3A B CSASEBvSSDEvSA2AA3A1Se eSDX1S ABX2SbpTerminalindex areaIEC 2699/01yS1 2 3A B CSASEBvSSDEvSA2AA3A1Se eSDX1S ABX2SbpTerminalindex areaIEC 2700/01ySPages 6 and 7Table 2 and table 4Under Tolerance of solder ball centre positionInstead of:x and x1read:X1 and X2Pages 9 and 10Tables 6 and table 8Under Tolerance of solder column centre positionInstead of:x and x1read:X1 and X2Octobre 2002 October 2002
