1、 IEC 61188-5-8Edition 1.0 2007-10INTERNATIONAL STANDARD Printed boards and printed board assemblies Design and use Part 5-8:Attachment(land/joint)considerations Area array components(BGA,FBGA,CGA,LGA)IEC 61188-5-8:2007(E)LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ON
2、LY,SUPPLIED BY BOOK SUPPLY BUREAU.THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC,Geneva,Switzerland All rights reserved.Unless otherwise specified,no part of this publication may be reproduced or utilized in any form or by any means,electronic or mechanical,including photocopying and mic
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9、 Tel.:+41 22 919 02 11 Fax:+41 22 919 03 00 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.IEC 61188-5-8Edition 1.0 2007-10INTERNATIONAL STANDARD Printed boards and printed board assemblies Design and use Part 5-8:Attachment(land/join
10、t)considerations Area array components(BGA,FBGA,CGA,LGA)INTERNATIONAL ELECTROTECHNICAL COMMISSION UICS 31.180 PRICE CODEISBN 2-8318-9343-7LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 61188-5-8 IEC:2007(E)CONTENTS FOREWORD.04 INTRO
11、DUCTION.1H1H6 1 Scope.2H2H7 2 Normative references.3H3H7 3 General information.4H4H8 3.1 General component description.5H5H8 3.2 Marking.6H6H8 3.3 Carrier packaging format.7H7H9 3.4 Process considerations.8H8H9 4 BGA(square).9H9H9 4.1 Field of application.10H10H9 4.2 Component descriptions.11H11H9 4
12、.2.1 Basic construction.12H12H9 4.2.2 Termination materials.13H13H10 4.2.3 Marking.14H14H11 4.2.4 Carrier package format.15H15H11 4.2.5 Process considerations.16H16H11 4.3 Component dimensions(square).17H17H11 4.3.1 PBGA 1,5 mm pitch component dimensions(square).18H18H12 4.3.2 PBGA 1,27 mm pitch com
13、ponent dimensions(square).19H19H14 4.3.3 PBGA 1,00 mm pitch component dimensions(square).20H20H15 4.4 Solder joint fillet design.21H21H17 4.4.1 Solder joint fillet design Non-collapsing,collapsing(level 3).22H22H17 4.5 Land pattern dimensions.23H23H18 4.5.1 PBGA 1,5 mm pitch land pattern dimensions(
14、square).24H24H19 4.5.2 PBGA 1,27 mm pitch land pattern dimensions(square).25H25H21 4.5.3 PBGA 1,00 mm pitch land pattern dimensions(square).26H26H23 5 FBGA(square).27H27H25 6 BGA(rectangular).28H28H25 6.1 Field of application.29H29H25 6.2 Component descriptions.30H30H25 6.2.1 Basic construction.31H3
15、1H25 6.2.2 Termination materials.32H32H25 6.2.3 Marking.33H33H26 6.2.4 Carrier package format.34H34H26 6.2.5 Process considerations.35H35H26 6.3 Component dimensions(rectangular).36H36H26 6.4 Solder joint fillet design.37H37H27 6.4.1 Solder joint fillet design Collapsing(level 3).38H38H27 6.4.2 Land
16、 approximation.39H39H28 6.4.3 Total variation.40H40H28 6.5 Land pattern dimensions.41H41H28 7 FBGA(rectangular).42H42H29 8 CGA.43H43H29 9 LGA.44H44H29 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.61188-5-8 IEC:2007(E)3 Bibliography.45H45H30 Figure 1 Area array land pattern configuration.46H46H7 Figure 2 BGA physical configuration examples.47H47H10 Figure 3 High land and eutectic solder ball and joint comparison.48H48H10 Figure 4
