1、INTERNATIONALSTANDARDIEC60748-23-4QC 165000-4First edition2002-05Semiconductor devices Integrated circuits Part 23-4:Hybrid integrated circuits and film structures Manufacturing line certification Blank detail specificationDispositifs semiconducteurs Circuits intgrs Partie 23-4:Circuits intgrs hybri
2、des et structures par films Certification de la ligne de fabrication Spcification particulire cadreReference numberIEC 60748-23-4:2002(E)LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.Publication numberingAs from 1 January 1997 all IE
3、C publications are issued with a designation in the60000 series.For example,IEC 34-1 is now referred to as IEC 60034-1.Consolidated editionsThe IEC is now publishing consolidated versions of its publications.For example,edition numbers 1.0,1.1 and 1.2 refer,respectively,to the base publication,theba
4、se publication incorporating amendment 1 and the base publication incorporatingamendments 1 and 2.Further information on IEC publicationsThe technical content of IEC publications is kept under constant review by the IEC,thus ensuring that the content reflects current technology.Information relating
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8、ther information.Customer Service CentreIf you have any questions regarding this publication or need further assistance,please contact the Customer Service Centre:Email:custserviec.chTel:+41 22 919 02 11Fax:+41 22 919 03 00LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION
9、ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.INTERNATIONALSTANDARDIEC60748-23-4QC 165000-4First edition2002-05Semiconductor devices Integrated circuits Part 23-4:Hybrid integrated circuits and film structures Manufacturing line certification Blank detail specificationDispositifs semiconducteurs Circuits intg
10、rs Partie 23-4:Circuits intgrs hybrides et structures par films Certification de la ligne de fabrication Spcification particulire cadre IEC 2002 Copyright-all rights reservedNo part of this publication may be reproduced or utilized in any form or by any means,electronic ormechanical,including photoc
11、opying and microfilm,without permission in writing from the publisher.International Electrotechnical Commission,3,rue de Varemb,PO Box 131,CH-1211 Geneva 20,SwitzerlandTelephone:+41 22 919 02 11 Telefax:+41 22 919 03 00 E-mail:inmailiec.ch Web:www.iec.chRFor price,see current cataloguePRICE CODEComm
12、ission Electrotechnique InternationaleInternational Electrotechnical Commission LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 60748-23-4 IEC:2002(E)INTERNATIONAL ELECTROTECHNICAL COMMISSION_SEMICONDUCTOR DEVICES INTEGRATED CIRCUITS
13、 Part 23-4:Hybrid integrated circuits and film structures Manufacturing line certification Blank detail specificationFOREWORD1)The IEC(International Electrotechnical Commission)is a worldwide organization for standardization comprisingall national electrotechnical committees(IEC National Committees)
14、.The object of the IEC is to promoteinternational co-operation on all questions concerning standardization in the electrical and electronic fields.Tothis end and in addition to other activities,the IEC publishes International Standards.Their preparation isentrusted to technical committees;any IEC Na
15、tional Committee interested in the subject dealt with mayparticipate in this preparatory work.International,governmental and non-governmental organizations liaisingwith the IEC also participate in this preparation.The IEC collaborates closely with the InternationalOrganization for Standardization(IS
16、O)in accordance with conditions determined by agreement between thetwo organizations.2)The formal decisions or agreements of the IEC on technical matters express,as nearly as possible,aninternational consensus of opinion on the relevant subjects since each technical committee has representationfrom all interested National Committees.3)The documents produced have the form of recommendations for international use and are published in the formof standards,technical specifications,technical reports
