1、NORMEINTERNATIONALECEIIECINTERNATIONALSTANDARD61190-1-1Premire ditionFirst edition2002-03Matriaux de fixation pour lesassemblages lectroniques Partie 1-1:Exigences relatives aux flux de brasagepour les interconnexions de haute qualitdans les assemblages de composantslectroniquesAttachment materials
2、for electronic assembly Part 1-1:Requirements for soldering fluxes for high-qualityinterconnections in electronics assemblyNumro de rfrenceReference numberCEI/IEC 61190-1-1:2002Copyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,downloaded on Nov-27-2014 by James Madison.No
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15、estions regarding thispublication or need further assistance,pleasecontact the Customer Service Centre:Email:custserviec.chTel:+41 22 919 02 11Fax:+41 22 919 03 00.Copyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,downloaded on Nov-27-2014 by James Madison.No further repro
16、duction or distribution is permitted.Uncontrolled when printed.NORMEINTERNATIONALECEIIECINTERNATIONALSTANDARD61190-1-1Premire ditionFirst edition2002-03Matriaux de fixation pour lesassemblages lectroniques Partie 1-1:Exigences relatives aux flux de brasagepour les interconnexions de haute qualitdans les assemblages de composantslectroniquesAttachment materials for electronic assembly Part 1-1:Requirements for soldering fluxes for high-qualityinterconnections in electronics assemblyPour prix,vo
