1、 CEI 60749-22(Premire dition 2002)DISPOSITIFS SEMICONDUCTEURS MTHODES DESSAIS MCANIQUESET CLIMATIQUES Partie 22:Robustesse des contacts soudsIEC 60749-22(First edition 2002)SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 22:Bond strengthC O R R I G E N D U M 1Page 6Au lieu de:Le comi
2、t a dcid que le contenu decette publication ne sera pas modifiavant 2012.lire:Le comit a dcid que le contenu decette publication ne sera pas modifiavant 2007.Page 7Instead of:The committee has decided that thecontents of this publication will remainunchanged until 2012.read:The committee has decided that thecontents of this publication will remainunchanged until 2007.Aot 2003August 2003
