1、INTERNATIONALSTANDARDIEC60748-23-2QC 165000-2First edition2002-05Semiconductor devices Integrated circuits Part 23-2:Hybrid integrated circuits and film structures Manufacturing line certification Internal visual inspection and special testsDispositifs semiconducteurs Circuits intgrs Partie 23-2:Cir
2、cuits intgrs hybrides et structures par films Certification de la ligne de fabrication Contrle visuel interne et essais spciauxReference numberIEC 60748-23-2:2002(E)LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.Publication numberingA
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9、TERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.INTERNATIONALSTANDARDIEC60748-23-2QC165000-2First edition2002-05Semiconductor devices Integrated circuits Part 23-2:Hybrid integrated circuits and film structures Manufacturing line certification Internal visual inspection and special t
10、estsDispositifs semiconducteurs Circuits intgrs Partie 23-2:Circuits intgrs hybrides et structures par films Certification de la ligne de fabrication Contrle visuel interne et essais spciaux IEC 2002 Copyright-all rights reservedNo part of this publication may be reproduced or utilized in any form o
11、r by any means,electronic ormechanical,including photocopying and microfilm,without permission in writing from the publisher.International Electrotechnical Commission,3,rue de Varemb,PO Box 131,CH-1211 Geneva 20,SwitzerlandTelephone:+41 22 919 02 11 Telefax:+41 22 919 03 00 E-mail:inmailiec.ch Web:w
12、ww.iec.chXDFor price,see current cataloguePRICE CODECommission Electrotechnique InternationaleInternational Electrotechnical Commission LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 60748-23-2 IEC:2002(E)CONTENTSFOREWORD.7INTRODUCT
13、ION.91Scope.102Normative references.103Definitions.114Apparatus.185Procedure.185.1General.185.2Sequence of inspection.195.3Inspection control.195.4Re-inspection.195.5Exclusions.195.6Magnification.195.7Format and conventions.195.8Interpretations.206Thin film element inspection.206.1Operating metalliz
14、ation non-conformances high magnification.206.2Passivation non-conformances high magnification.266.3Glassivation non-conformances,high magnification.276.4Substrate non-conformances high magnification.286.5Foreign material non-conformances low magnification.306.6Thin film resistor non-conformances,hi
15、gh magnification.316.7Laser trimmed thin film resistor non-conformances,high magnification.366.8Multilevel thin film non-conformances,high magnification.456.9Coupling(air)bridge non-conformances high magnification.457Planar thick film element inspection.477.1Operating metallization non-conformances
16、low magnification.477.2Substrate non-conformances,low magnification.517.3Thick film resistor non-conformances,low magnification.547.4Trimmed thick film resistor non-conformances,low magnification.567.5Multilevel thick film non-conformances,low magnification.587.6All thin film capacitors and overlay capacitors used in GaAs microwavedevices,low magnification.598Active and passive elements.599Element attachment(assembly),magnification 10 to 60.599.1Solder connections(general appearance).599.2Elemen
