1、INTERNATIONALSTANDARDIEC60748-23-3QC 165000-3First edition2002-05Semiconductor devices Integrated circuits Part 23-3:Hybrid integrated circuits and film structures Manufacturing line certification Manufacturers self-audit checklist and reportDispositifs semiconducteurs Circuits intgrs Partie 23-3:Ci
2、rcuits intgrs hybrides et structures par films Certification de la ligne de fabrication Liste de contrle et rapport dvaluation internepour fabricantsReference numberIEC 60748-23-3:2002(E)LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.
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9、RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.INTERNATIONALSTANDARDIEC60748-23-3QC 165000-3First edition2002-05Semiconductor devices Integrated circuits Part 23-3:Hybrid integrated circuits and film structures Manufacturing line certification Manufacturers sel
10、f-audit checklist and reportDispositifs semiconducteurs Circuits intgrs Partie 23-3:Circuits intgrs hybrides et structures par films Certification de la ligne de fabrication Liste de contrle et rapport dvaluation internepour fabricants IEC 2002 Copyright-all rights reservedNo part of this publicatio
11、n may be reproduced or utilized in any form or by any means,electronic ormechanical,including photocopying and microfilm,without permission in writing from the publisher.International Electrotechnical Commission,3,rue de Varemb,PO Box 131,CH-1211 Geneva 20,SwitzerlandTelephone:+41 22 919 02 11 Telef
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13、8-23-3 IEC:2002(E)CONTENTSFOREWORD.4INTRODUCTION.51Scope.62Document information.62.1General.62.2Normative references.63Definitions.74General requirements.74.1Self-audit checklist and report for thick and thin filmhybrid integrated circuit manufacturers.84.2Description of report/company structure.94.
14、3Approval information.104.4Summary of testing.124.5Analytical methods.144.6Control of procurement sources and incoming material.154.7Control of procurement sources and incoming material,continued.154.8Environmental control and static handling.164.9Change notification requirements.174.10 Hybrid desig
15、n.175Thick film processing.195.1Artwork and screen fabrication.195.2Substrates.205.3Substrate saw or scribe and break and substrate hole drilling.215.4Thick film pastes and printing.225.5Drying and firing.265.6Resistor trimming.275.7Inspection and test of processing.285.8Rework.296Thin film processi
16、ng.306.1Artwork and mask fabrication.306.2Substrates.316.3Substrate saw or scribe and break and substrate hole drilling.336.4Thin film processing materials and pattern forming.336.5Drying and stabilization.356.6Resistor trimming.366.7Rework.377Hybrid assembly.387.1Solder assembly.397.2Chip and wire assembly.468Test and dispatch.578.1Electrical tests.588.2Burn-in.598.3Endurance.618.4Dry heat(stabilization bake).628.5Change of temperature.63LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL U
