1、 IEC 60286-5Edition 2.1 2009-05INTERNATIONAL STANDARD Packaging of components for automatic handling Part 5:Matrix trays IEC 60286-5:2003+A1:2009(E)LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.THIS PUBLICATION IS COPYRIGHT PROTECTED
2、 Copyright 2009 IEC,Geneva,Switzerland All rights reserved.Unless otherwise specified,no part of this publication may be reproduced or utilized in any form or by any means,electronic or mechanical,including photocopying and microfilm,without permission in writing from either IEC or IECs member Natio
3、nal Committee in the country of the requester.If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,please contact the address below or your local IEC member National Committee for further information.IEC Central Office 3,rue de Varemb
4、 CH-1211 Geneva 20 Switzerland Email:inmailiec.ch Web:www.iec.ch About the IEC The International Electrotechnical Commission(IEC)is the leading global organization that prepares and publishes International Standards for all electrical,electronic and related technologies.About IEC publications The te
5、chnical content of IEC publications is kept under constant review by the IEC.Please make sure that you have the latest edition,a corrigenda or an amendment might have been published.?Catalogue of IEC publications:www.iec.ch/searchpub The IEC on-line Catalogue enables you to search by a variety of cr
6、iteria(reference number,text,technical committee,).It also gives information on projects,withdrawn and replaced publications.?IEC Just Published:www.iec.ch/online_news/justpub Stay up to date on all new IEC publications.Just Published details twice a month all new publications released.Available on-
7、line and also by email.?Electropedia:www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than 20 000 terms and definitions in English and French,with equivalent terms in additional languages.Also known as the International Electrotechnical Voc
8、abulary online.?Customer Service Centre:www.iec.ch/webstore/custserv If you wish to give us your feedback on this publication or need further assistance,please visit the Customer Service Centre FAQ or contact us:Email:csciec.ch Tel.:+41 22 919 02 11 Fax:+41 22 919 03 00 LICENSED TO MECON Limited.-RA
9、NCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.IEC 60286-5Edition 2.1 2009-05INTERNATIONAL STANDARD Packaging of components for automatic handling Part 5:Matrix trays INTERNATIONAL ELECTROTECHNICAL COMMISSION CGICS 31.020 PRICE CODEISBN 2-8318-1034-5 Registered t
10、rademark of the International Electrotechnical Commission LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 60286-5 IEC:2003+A1:2009(E)CONTENTS FOREWORD.4 1 Scope.6 2 Material.6 2.1 Electrostatic dissipative requirements.6 2.2 Effect o
11、f properties.6 2.3 Recycling and rigidity.6 3 Mechanical stability.6 3.1 Loaded tray.6 3.2 Empty tray.6 3.3 Outer edges.7 4 Tray design,dimensions and other physical properties.7 4.1 Tray design.7 4.1.1 Number of pockets.7 4.1.2 Orientation of pockets.7 4.1.3 Design rules for pocket density.7 4.2 Ov
12、erall tray dimensions.8 4.3 Cell dimensions.8 4.4 Tray vacuum pick-up sites.10 4.4.1 Size.10 4.4.2 Centre.10 4.4.3 Perimeter.10 4.5 Detail features.10 4.6 Weight.10 4.7 Movement of components.10 4.8 Dimensional information.11 5 Polarity and orientation of components in the tray.13 5.1 Pin one.13 5.2
13、 Loading.13 6 Tray stacking.13 6.1 Bundling.13 6.2 Top protection.14 6.3 Partial filling.14 6.4 Protrusion of components.14 6.5 Stack-up.14 6.6 Damaging of components.14 7 Missing components.14 8 Marking.14 Annex A(informative)List of existing matrix trays with wide anticipated use in the electronic
14、 industries.15 Annex B (normative)Measurement methodology of the tray dimensions.27 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.60286-5 IEC:2003+A1:2009(E)3 Figure 1 Sample of leaded packages.9 Figure 2 Sample of grid array package
15、s.9 Figure 3 Tray main view.11 Figure 4 Tray stacking details.12 Figure A.1 Thin tray.16 Figure A.2 Thick matrix.24 Figure B.1 Cross-sections of the outline dimensions.28 Figure B.2 Tray thickness.28 Figure B.4 Examples of tray warpage.28 Figure B.5 Top view of a tray showing the measurement locatio
16、ns for the outline dimensions.29 Figure B.6 Measurement locations for tray thickness.30 Figure B.7 Holding position in calliper jaws for measurement.30 Figure B.8 Correction of a lift of the tray at the measurement point.30 Figure B.9 Measurement locations for the stackable design.31 Figure B.10 Measurement points for warpage.31 Table 1 P and W dimension.7 Table 2 Height dimensions.8 Table A.1 Variations.18 Table A.2 PGA variations.26 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE A
