1、 INTERNATIONAL STANDARD IEC61760-1 Second edition2006-04 Surface mounting technology Part 1:Standard method for the specification of surface mounting components(SMDs)Reference number IEC 61760-1:2006(E)LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK
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9、EC 2006 Copyright-all rights reserved No part of this publication may be reproduced or utilized in any form or by any means,electronic or mechanical,including photocopying and microfilm,without permission in writing from the publisher.International Electrotechnical Commission,3,rue de Varemb,PO Box
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11、NAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 61760-1 IEC:2006(E)CONTENTS FOREWORD.4 INTRODUCTION.6 1 Scope and object.7 1.1 Scope.7 1.2 Object.7 2 Normative references.7 3 Terms and definitions.8 4 Requirements for component design and component specifications.10 4.1 General requir
12、ement.10 4.2 Packaging.10 4.3 Labelling of product packaging.10 4.4 Component marking.11 4.5 Storage and transportation.12 4.6 Component outline and design.12 4.7 Mechanical stress.16 4.8 Component reliability assurance.16 4.9 Additional requirements for compatibility with lead-free soldering.16 5 S
13、pecification of assembly process conditions.16 5.1 General.16 5.2 Securing the component on the substrate prior to soldering.18 5.3 Mounting methods.19 5.4 Cleaning(where applicable).20 5.5 Removal and/or replacement of SMDs.21 6 Typical process conditions.22 6.1 Soldering processes,temperature/time
14、 profiles.22 6.2 Typical cleaning conditions for assemblies.26 7 Requirements for components and component specifications related to suitability with various mounting processes.27 7.1 General.27 7.2 Wettability.27 7.3 Resistance to dissolution of metallization.27 7.4 Resistance to soldering heat.27
15、7.5 Resistance to cleaning solvent.28 7.6 Soldering profiles.28 7.7 Bonding strength test for the component glue interface test.28 Bibliography.30 Figure 1 Example of a component with marked specific orientation put in tape and tray.11 Figure 2 Vacuum pipette,pick-up area and component compartment:E
16、xample for a component with a flat surface.13 Figure 3 Coplanarity of terminals.13 Figure 4 Stable seating of component.14 Figure 5 Unstable seating of component.14 Figure 6 Terminals arranged peripherally in two rows.14 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.61760-1 IEC:2006(E)3 Figure 7 Good contrast to component body and surroundings.14 Figure 8 Component weight/pipette suction strength.15 Figure 9 Process steps for sol
