1、 IEC 62047-25 Edition 1.0 2016-08 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 25:Silicon based MEMS fabrication technology Measurement method of pull-press and shearing strength of micro bonding area Dispositifs semiconducteurs Dispositifs m
2、icrolectromcaniques Partie 25:Technologie de fabrication de MEMS base de silicium Mthode de mesure de la rsistance la traction-compression et au cisaillement dune micro zone de brasure IEC 62047-25:2016-08(en-fr)colourinside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2016 IEC,Geneva,Switzerla
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