1、 IEC/TS 62647-22 Edition 1.0 2013-09 TECHNICAL SPECIFICATION Process management for avionics Aerospace and defence electronic systems containing lead-free solder Part 22:Technical guidelines IEC/TS 62647-22:2013(E)Copyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,downloade
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10、 62647-22 Edition 1.0 2013-09 TECHNICAL SPECIFICATION Process management for avionics Aerospace and defence electronic systems containing lead-free solder Part 22:Technical guidelines INTERNATIONAL ELECTROTECHNICAL COMMISSION XB ICS 03.100.50;31.020;49.060 PRICE CODE ISBN 978-2-8322-1112-0 Registere
11、d trademark of the International Electrotechnical Commission Warning!Make sure that you obtained this publication from an authorized distributor.Copyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,downloaded on Nov-27-2014 by James Madison.No further reproduction or distribu
12、tion is permitted.Uncontrolled when printed.2 TS 62647-22 IEC:2013(E)CONTENTS FOREWORD.5 INTRODUCTION.7 1 Scope.9 2 Normative references.9 3 Terms,definitions and abbreviations.10 3.1 Terms and definitions.10 3.2 Abbreviations.15 4 Approach.16 4.1 General.16 4.2 Assumption.16 5 General Pb-free solde
13、r alloy behavior.17 5.1 General.17 5.2 Elevated temperature.17 5.3 Low temperatures.18 5.4 Temperature cycling.20 5.4.1 General.20 5.4.2 Solder thermal cycling failure mode.21 5.4.3 Stress relaxation considerations.21 5.4.4 Ramp rate.21 5.4.5 Dwell time at elevated temperature.21 5.4.6 Dwell time at
14、 low temperature.22 5.5 Rapid mechanical loading(vibration/shock).22 6 System level service environment.22 6.1 General.22 6.2 Service environment.23 6.3 Electronics/electrical equipment thermal environments.23 6.3.1 General.23 6.3.2 Electronics/electrical equipment steady temperatures.23 6.3.3 Elect
15、ronics/electrical equipment temperature cycling.23 6.4 Vibration and shock.23 6.5 Humidity.24 6.6 Other environments:salt spray,fungus,cooling air quality,and fluid compatibility.24 6.7 Other special requirements.24 7 High performance electronics testing.24 8 Solder joint reliability considerations.
16、25 8.1 General.25 8.1.1 Overview.25 8.1.2 Final solder joint composition.25 8.1.3 Solder wetting and final joint shape.25 8.1.4 Strength of the PCB/PWB and component interfaces.26 8.2 Mixing of solder alloys and finishes.26 8.3 Pb-free terminations in tin-lead joints.26 8.3.1 General.26 8.3.2 Ball grid array Pb-free terminations in tin-lead joints.27 Copyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,downloaded on Nov-27-2014 by James Madison.No further reproduction