1、 IEC/TS 62647-23 Edition 1.0 2013-10 TECHNICAL SPECIFICATION Process management for avionics Aerospace and defence electronic systems containing lead-free solder Part 23:Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies IEC/TS 62647-23:2013(E)colour
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10、adison.No further reproduction or distribution is permitted.Uncontrolled when printed.IEC/TS 62647-23 Edition 1.0 2013-10 TECHNICAL SPECIFICATION Process management for avionics Aerospace and defence electronic systems containing lead-free solder Part 23:Rework and repair guidance to address the imp
11、lications of lead-free electronics and mixed assemblies INTERNATIONAL ELECTROTECHNICAL COMMISSION X ICS 03.100.50;31.020;49.060 PRICE CODE ISBN 978-2-8322-1162-5 Registered trademark of the International Electrotechnical Commission Warning!Make sure that you obtained this publication from an authori
12、zed distributor.colourinsideCopyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,downloaded on Nov-27-2014 by James Madison.No further reproduction or distribution is permitted.Uncontrolled when printed.2 TS 62647-23 IEC:2013(E)CONTENTS FOREWORD.4 INTRODUCTION.6 1 Scope.8 2 N
13、ormative references.8 3 Terms,definitions and abbreviations.9 3.1 Terms and definitions.9 3.2 Abbreviations.14 4 Pb-free concerns.16 4.1 General.16 4.2 Reliability.16 4.2.1 General.16 4.2.2 Mixed metallurgy reliability.16 4.3 Configuration management.17 4.4 Risk management.18 4.5 Tin whiskers.18 4.6
14、 Copper dissolution(erosion).18 5 Materials.18 5.1 Solder.18 5.1.1 General.18 5.1.2 Solder alloys.18 5.1.3 Solder forms.19 5.2 Fluxes.20 5.3 Piece parts.20 5.3.1 General.20 5.3.2 Termination finishes.20 5.3.3 Area arrays(BGA,CSP,etc.).20 5.4 Printed circuit boards/printed wiring boards.21 5.4.1 Lami
15、nate material.21 5.4.2 Surface finish.21 5.5 Conformal coatings.21 6 Soldering equipment.22 6.1 General.22 6.2 Hand soldering equipment.22 6.2.1 General hand soldering equipment considerations.22 6.2.2 Tip selection.22 6.2.3 Soldering iron tip life.23 6.3 Fountain soldering.24 6.4 Convective solderi
16、ng equipment.25 6.4.1 General.25 6.4.2 Thermal profile issues.25 7 General rework/repair considerations.26 7.1 General.26 7.2 Rework/repair procedure order of precedence.26 7.3 Technician training.27 7.4 Pb-free rework/repair considerations.27 7.4.1 General.27 Copyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,downloaded on Nov-27-2014 by James Madison.No further reproduction or distribution is permitted.Uncontrolled when printed.TS 62647-23 IEC:2013(E)3 7.4.2 Gener
