1、 IEC/TS 62686-1 Edition 1.0 2012-09 TECHNICAL SPECIFICATION Process management for avionics Electronic components for aerospace,defence and high performance(ADHP)applications Part 1:General requirements for high reliability integrated circuits and discrete semiconductors IEC/TS 62686-1:2012(E)Copyri
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10、rther reproduction or distribution is permitted.Uncontrolled when printed.IEC/TS 62686-1Edition 1.0 2012-09TECHNICAL SPECIFICATIONProcess management for avionics Electronic components for aerospace,defence and high performance(ADHP)applications Part 1:General requirements for high reliability integr
11、ated circuits and discrete semiconductors INTERNATIONAL ELECTROTECHNICAL COMMISSION XBICS 03.100.50;31.020;49.060 PRICE CODEISBN 978-2-83220-345-3 Registered trademark of the International Electrotechnical Commission Warning!Make sure that you obtained this publication from an authorized distributor
12、.Copyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,downloaded on Nov-27-2014 by James Madison.No further reproduction or distribution is permitted.Uncontrolled when printed.2 TS 62686-1 IEC:2012(E)CONTENTS FOREWORD.5 INTRODUCTION.7 1 Scope.8 2 Normative references.8 3 Term
13、s,definitions and abbreviations.12 3.1 Terms and definitions.12 3.2 Abbreviations.14 4 Technical requirements.16 4.1 General.16 4.2 Procedures.16 4.2.1 General.16 4.2.2 Product discontinuance.16 4.2.3 ESD protection during manufacture.16 4.2.4 Specification control.17 4.2.5 Traceability.17 4.3 Produ
14、ct or process change notification(PCN).17 4.3.1 General.17 4.3.2 Notification.17 4.3.3 Notification details.17 4.3.4 Notifiable changes.18 4.4 Shipment controls.18 4.4.1 General.18 4.4.2 Shipping container and date code marking.18 4.4.3 Date code remarking.18 4.4.4 Inner container formation.18 4.4.5
15、 Date code age on delivery.19 4.4.6 ESD marking.19 4.4.7 MSL.19 4.4.8 Lead-free marking.19 4.4.9 Labels.19 4.5 Electrical.20 4.5.1 General.20 4.5.2 Electrical test.20 4.5.3 Electrical parameter assessment.20 4.5.4 SDRAM memories.20 4.5.5 Logic families.21 4.5.6 Power MOSFETs.21 4.5.7 Silicon rectifi
16、er diodes.21 4.6 Mechanical.21 4.6.1 General.21 4.6.2 Device or shipping container marking.21 4.6.3 Small packages.21 4.6.4 Moisture sensitivity.21 4.6.5 Robustness of hermetic seals.21 4.6.6 Termination finishes.22 4.7 Audit capability.22 Copyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,downloaded on Nov-27-2014 by James Madison.No further reproduction or distribution is permitted.Uncontrolled when printed.TS 62686-1 IEC:2012(E)3 4.7.1 General.22 4.7.2 Internal q
