1、 IEC 63003 Edit ion 1.0 2015-12 INTER NA TIONA L STA NDA R D St andard for t he common test int erface pin map configuration for high-density,single-tier elect ronics test requirement s utilizing IEEE St d 1505 IEC 63003:2015-12(en)IEEE St d 1505.1-2008 IEEE Std 1505.1 colourinsideAuthorized license
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12、 Centre:csciec.ch.Authorized licensed use limited to:University of Waterloo.Downloaded on April 08,2016 at 00:47:07 UTC from IEEE Xplore.Restrictions apply.IEC 63003 Edit ion 1.0 2015-12 INTER NA TIONA L STA NDA R D Standard for the common test interface pin map configuration for high-density,single
13、-tier electronics test requirements utilizing IEEE Std 1505 INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 25.040 IEC ISBN:978-2-8322-2941-5 IEEE ISBN:978-1-5044-0580-5STD20742 W arning!Make sur e that y ou obtained this publication from an author ized distributor.IEEE Std 1505.1 Register ed tr adema
14、r k of the Inter national Electr otechnical Commission colourinsideAuthorized licensed use limited to:University of Waterloo.Downloaded on April 08,2016 at 00:47:07 UTC from IEEE Xplore.Restrictions apply.v ii Contents 1.Ov er v iew.1 1.1 Scope.1 1.2 Pu rpose.2 1.3 St a t ement of t he pr oblem.2 2.
15、Norma t iv e references.3 3.Definitions,a cron yms,a n d a bbrev ia tions.4 3.1 Definit ion s.4 3.2 Specifica t ion t erms.4 3.3 Acr on yms and a bbrev ia t ions.4 4.Com mon t est int er fa ce r equ irement s.8 4.1 Int rod u ct ion.8 4.2 CTI open syst em r eq uir ement s.8 4.3 CTI cost req u irement
16、 s.9 4.4 Ver t ica l int egra tion t est su pport req u irements.9 4.5 CTI configu r a t ion/int eropera bility r equ ir ements.10 4.6 Ma int a ina bility/end-u ser su ppor t requ ir ement s.10 4.7 Sca lea ble a r chit ect u re r equ ir ements.10 4.8 Physica l fr amework r equ ir ement s.12 4.9 Relia bility req uir ements.17 4.10 CTI connect or foot pr int/pa ra met r ic r equ ir ement s.18 4.11 CTI pin ma p r equ ir ements.22 4.12 CTI pin ma p inpu t/ou t pu t configu ra t ion .33 An nex A(norm
