1、 IEC/PAS 61189-3-913 Edition 1.0 2011-01 PUBLICLY AVAILABLE SPECIFICATION PRE-STANDARD Test methods for electrical materials,printed boards and other interconnection structures and assemblies Part 3-913:Test methods for interconnection structures(printed boards)Electronic circuit board for high-brig
2、htness LEDs IEC/PAS 61189-3-913:2011(E)colourinsideCopyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,downloaded on Nov-28-2014 by James Madison.No further reproduction or distribution is permitted.Uncontrolled when printed.THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright
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10、Thomson Reuters(Scientific),Inc.,downloaded on Nov-28-2014 by James Madison.No further reproduction or distribution is permitted.Uncontrolled when printed.IEC/PAS 61189-3-913 Edition 1.0 2011-01 PUBLICLY AVAILABLE SPECIFICATION PRE-STANDARD Test methods for electrical materials,printed boards and ot
11、her interconnection structures and assemblies Part 3-913:Test methods for interconnection structures(printed boards)Electronic circuit board for high-brightness LEDs INTERNATIONAL ELECTROTECHNICAL COMMISSION X ICS 31.180 PRICE CODE ISBN 978-2-88912-343-8 Registered trademark of the International Ele
12、ctrotechnical Commission colourinsideCopyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,downloaded on Nov-28-2014 by James Madison.No further reproduction or distribution is permitted.Uncontrolled when printed.2 PAS 61189-3-913 IEC:2011(E)CONTENTS FOREWORD.5 1 Scope.7 2 Ter
13、ms and definitions.7 3 Test conditions.7 3.1 Standard condition.7 3.2 Specified condition.7 4 Specimen.7 4.1 Preparation of specimen.7 4.2 Test pattern.7 5 Pre-conditioning.8 6 Appearance,micro-sectioning and dimensions.8 6.3 Dimension.8 6.3.1 Appearance.8 6.3.2 Thickness.8 6.3.3(Through-)Hole diame
14、ter.8 6.3.4 Hole position.8 6.3.5 Conductor width and minimum conductor spacing.9 6.3.6 Conductor nick and extraneous copper.9 6.3.7 Land.9 6.3.8 Land width.9 6.3.9 Flatness.9 7 Electrical tests.10 7.1 Conductor resistance.10 7.1.1 Conductor.10 7.1.2 Plated through-hole.10 7.1.3 Interconnection.11 7
15、.2 Current tolerance of conductor(when specified in a detailed specification).11 7.3 Current tolerance of plated through-hole.11 7.4 Withstanding voltage of surface layer.12 7.5 Interlayer withstanding voltage.12 7.6 Insulation resistance of surface layer(normal and resistance to humidity(temperatur
16、e-humidity cycle and steady state).12 7.7 Insulation resistance of inner layer(normal and resistance to humidity(temperature-humidity cycle and steady state).13 7.8 Insulation resistance between inner layers(normal and resistance to humidity(temperature-humidity cycle and steady state).13 7.9 Electric integrity.13 7.9.1 Circuit insulation.13 7.9.2 Conduction.13 8 Mechanical tests.13 8.1 Peel strength of conductor.13 8.2 Peeling strength of a land with non-plated hole.14 8.3 Peeling strength o
