1、 IEC TR 62343-6-5 Edition 2.0 2014-06 TECHNICAL REPORT Dynamic modules Part 6-5:Design guide Investigation of operating mechanical shock and vibration tests for dynamic modules IEC TR 62343-6-5:2014-06(en)colourinsideCopyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,downlo
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11、Customer Service Centre:csciec.ch.Copyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,downloaded on Nov-27-2014 by James Madison.No further reproduction or distribution is permitted.Uncontrolled when printed.IEC TR 62343-6-5 Edition 2.0 2014-06 TECHNICAL REPORT Dynamic modul
12、es Part 6-5:Design guide Investigation of operating mechanical shock and vibration tests for dynamic modules INTERNATIONAL ELECTROTECHNICAL COMMISSION T ICS 33.180.20 PRICE CODE ISBN 978-2-8322-1641-5 Registered trademark of the International Electrotechnical Commission Warning!Make sure that you ob
13、tained this publication from an authorized distributor.colourinsideCopyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,downloaded on Nov-27-2014 by James Madison.No further reproduction or distribution is permitted.Uncontrolled when printed.2 IEC TR 62343-6-5:2014 IEC 2014 C
14、ONTENTS FOREWORD.4 1 Scope.6 2 Background.6 3 Questionnaire results in Japan.6 4 Evaluation plan.7 5 Evaluation results.7 5.1 Step 1.7 Evaluation of hammer impact.7 5.1.1 Evaluation of adjacent board insertion and rack handle impact.9 5.1.25.2 Step 2.9 5.3 Step 3.11 MEMS-VOA.11 5.3.1 WSS and tuneabl
15、e laser.14 5.3.26 Simulation.16 6.1 Simulation model.16 6.2 Frequency characteristics.17 6.3 Dependence on PC board design.18 6.4 Consistency of evaluation and simulation results.19 7 Summary.19 8 Conclusions.20 Annex A(informative)Results of a questionnaire on dynamic module operating shock and vib
16、ration test conditions.21 A.1 Background.21 A.2 Questionnaire methodology.21 A.3 Survey result.21 Bibliography.24 Figure 1 Photos of evaluating hammer impact,rack and boards.7 Figure 2 Evaluation results of hammer impact H.8 Figure 3 Photos of evaluating adjacent board insertion and rack handle impact.9 Figure 4 DUT(VOA and WSS)installed on PC boards and rack for second step of the evaluation.10 Figure 5 Oscilloscope display of waveform changes in vibration and optical output.10 Figure 6 Eval
