1、 IEC TS 62647-3 Edition 1.0 2014-02 TECHNICAL SPECIFICATION Process management for avionics Aerospace and defence electronic systems containing lead-free solder Part 3:Performance testing for systems containing lead-free solder and finishes IEC TS 62647-3:2014-02(en)colourinsideCopyrighted material
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12、S 62647-3 Edition 1.0 2014-02 TECHNICAL SPECIFICATION Process management for avionics Aerospace and defence electronic systems containing lead-free solder Part 3:Performance testing for systems containing lead-free solder and finishes INTERNATIONAL ELECTROTECHNICAL COMMISSION X ICS 03.100.50;31.020;
13、49.060 PRICE CODE ISBN 978-2-8322-1456-5 Registered trademark of the International Electrotechnical Commission Warning!Make sure that you obtained this publication from an authorized distributor.colourinsideCopyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,downloaded on No
14、v-27-2014 by James Madison.No further reproduction or distribution is permitted.Uncontrolled when printed.2 IEC TS 62647-3:2014 IEC 2014 CONTENTS FOREWORD.4 INTRODUCTION.6 1 Scope.8 2 Normative references.9 3 Terms,definitions and abbreviations.9 3.1 Terms and definitions.9 3.2 Abbreviations.10 4 As
15、sumption.11 5 Default test methods.11 5.1 General.11 5.2 Test vehicles.11 5.2.1 Test vehicle type.11 5.2.2 Sample size.12 5.3 Pre-conditioning by thermal aging method.12 5.3.1 General.12 5.3.2 Thermal aging acceleration model.12 5.3.3 Default test parameters.13 5.4 Default temperature cycle test met
16、hod.13 5.4.1 Test parameters.13 5.4.2 Test duration.13 5.4.3 Failure determination and analysis.13 5.4.4 Acceleration model.14 5.5 Vibration test.15 5.6 Mechanical shock.16 5.7 Combined environments.16 6 Protocol to design and conduct performance tests.16 6.1 General.16 6.2 Test vehicles.17 6.3 Temperature cycle test protocol.17 6.3.1 General.17 6.3.2 Measure the recovery time.17 6.3.3 Determine the high-temperature dwell times and temperatures.18 6.3.4 Select other test parameters as appropr
