1、 IEC/TS 62647-2 Edition 1.0 2012-11 TECHNICAL SPECIFICATION Process management for avionics Aerospace and defence electronic systems containing lead-free solder Part 2:Mitigation of deleterious effects of tin IEC/TS 62647-2:2012(E)colourinsideCopyrighted material licensed to BR Demo by Thomson Reute
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10、ontrolled when printed.IEC/TS 62647-2Edition 1.0 2012-11TECHNICAL SPECIFICATIONProcess management for avionics Aerospace and defence electronic systems containing lead-free solder Part 2:Mitigation of deleterious effects of tin INTERNATIONAL ELECTROTECHNICAL COMMISSION XBICS 03.100.50;31.020;49.060
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12、4 by James Madison.No further reproduction or distribution is permitted.Uncontrolled when printed.2 TS 62647-2 IEC:2012(E)CONTENTS FOREWORD.4 INTRODUCTION.6 1 Scope.7 2 Normative references.7 3 Terms,definitions and abbreviations.8 Terms and definitions.8 3.1 Abbreviations.11 3.24 Technical requirem
13、ent.12 Control level requirements.12 4.1 General.12 4.1.1 Control levels and levels of integration.14 4.1.2 COTS and level selection.14 4.1.3 Other level selection information.14 4.1.4 Requirements for control levels.15 4.2 Control level 1 requirements.15 4.2.1 Control level 2A requirements.15 4.2.2
14、 Control level 2B requirements.16 4.2.3 Control level 2C requirements.17 4.2.4 Control level 3 requirements.19 4.2.5 Requirements for mitigating tin whisker risk for solder joints.19 4.2.6 Implementation methods.20 4.3 Flowing requirements to lower level suppliers(applies to control level 4.3.12B,co
15、ntrol level 2C,and control level 3).20 Detecting and controlling Pb-free tin finish introduction.20 4.3.2 Sample monitoring plans(applies to control level 2B and control level 4.3.32C).20 Lot monitoring requirements(applies to control level 3).20 4.3.4 Methods for mitigating impact of Pb-free tin(ap
16、plies to control level 2B,4.4control level 2C).21 General.21 4.4.1 Hard potting and encapsulation.21 4.4.2 Physical barriers.21 4.4.3 Conformal and other coats.21 4.4.4 SnPb soldering process with validated coverage.22 4.4.5 Circuit and design analysis.22 4.4.6 Part selection process.23 4.5 Assessment and documentation of risk and mitigation effectiveness.23 4.6 General.23 4.6.1 Elements of assessment.24 4.6.2 Other risk analysis issues.24 4.6.3Annex A(informative)Guidance on control levels,r
