1、 IEC TR 61189-5-506 Edition 1.0 2019-06 TECHNICAL REPORT Test methods for electrical materials,printed boards and other interconnection structures and assemblies Part 5-506:General test methods for materials and assemblies An intercomparison evaluation to implement the use of fine-pitch test structu
2、res for surface insulation resistance(SIR)testing of solder fluxes in accordance with IEC 61189-5-501 IEC TR 61189-5-506:2019-06(en)colourinside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2019 IEC,Geneva,Switzerland All rights reserved.Unless otherwise specified,no part of this publication ma
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8、 on this publication or need further assistance,please contact the Customer Service Centre:salesiec.ch.Electropedia-www.electropedia.org The worlds leading online dictionary on electrotechnology,containing more than 22 000 terminological entries in English and French,with equivalent terms in 16 addi
9、tional languages.Also known as the International Electrotechnical Vocabulary(IEV)online.IEC Glossary-std.iec.ch/glossary 67 000 electrotechnical terminology entries in English and French extracted from the Terms and Definitions clause of IEC publications issued since 2002.Some entries have been coll
10、ected from earlier publications of IEC TC 37,77,86 and CISPR.IEC TR 61189-5-506 Edition 1.0 2019-06 TECHNICAL REPORT Test methods for electrical materials,printed boards and other interconnection structures and assemblies Part 5-506:General test methods for materials and assemblies An intercompariso
11、n evaluation to implement the use of fine-pitch test structures for surface insulation resistance(SIR)testing of solder fluxes in accordance with IEC 61189-5-501 INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 31.180 ISBN 978-2-8322-7083-7 Registered trademark of the International Electrotechnical Com
12、mission Warning!Make sure that you obtained this publication from an authorized distributor.colourinside 2 IEC TR 61189-5-506:2019 IEC 2019 CONTENTS FOREWORD.4 INTRODUCTION.6 1 Scope.7 2 Normative references.7 3 Terms and definitions.7 4 Test board concept for intercomparison.7 4.1 The need for a fi
13、ne-pitch SIR pattern.7 4.2 Test board design.8 4.3 Test board fluxing.9 5 Test procedure for intercomparison.10 5.1 Sample preparation.10 5.2 Preparation of samples for humidity chamber.11 5.3 Placement of samples inside the humidity chamber.11 5.4 Resistance measurements.12 5.5 Evaluation of result
14、s.12 5.6 Additional information.12 6 Results.12 Bibliography.23 Figure 1 TB144.9 Figure 2 Connector arrangement.11 Figure 3 Sample orientation in test chamber.12 Figure 4 Participants(a to f)resistance measurements for the six test patterns on the checker board.13 Figure 5 Participant A control boar
15、ds.13 Figure 6 Participant A flux loaded boards.14 Figure 7 Participant B control boards.14 Figure 8 Participant B flux loaded boards.14 Figure 9 Participant C control boards.15 Figure 10 Participant C flux loaded boards.15 Figure 11 Participant D control boards.15 Figure 12 Participant D flux loade
16、d boards.16 Figure 13 Participant E control boards.16 Figure 14 Participant E flux loaded boards.16 Figure 15 Participant F control boards.17 Figure 16 Participant F flux loaded boards.17 Figure 17 Participant G control boards.17 Figure 18 Participant G flux loaded boards.18 Figure 19 Participant D,and evidence of a fibre and the effect on the SIR.18 Figure 20 Participant E and evidence or corrosion shorting across the gap.18 Figure 21 Participant G and evidence of a water droplet and the result
