1、Designation:F211301(Reapproved 2011)Standard Guide forAnalysis and Reporting the Impurity Content and Grade ofHigh Purity Metallic Sputtering Targets for Electronic ThinFilm Applications1This standard is issued under the fixed designation F2113;the number immediately following the designation indica
2、tes the year oforiginal adoption or,in the case of revision,the year of last revision.A number in parentheses indicates the year of last reapproval.Asuperscript epsilon()indicates an editorial change since the last revision or reapproval.1.Scope1.1 This guide covers sputtering targets used as thin f
3、ilmsource material in fabricating semiconductor electronic de-vices.It should be used to develop target specifications forspecific materials and should be referenced therein.1.2 This standard sets purity grade levels,analytical meth-ods and impurity content reporting method and format.1.2.1 The grad
4、e designation is a measure of total metallicimpurity content.The grade designation does not necessarilyindicate suitability for a particular application because factorsother than total metallic impurity may influence performance.2.Referenced Documents2.1 ASTM Standards:2F1593 Test Method for Trace M
5、etallic Impurities in Elec-tronic Grade Aluminum by High Mass-Resolution Glow-Discharge Mass Spectrometer3.Terminology3.1 Definitions of Terms Specific to This Standard:3.1.1 finished product,nfor the purpose of this standard,a“finished product”is a manufactured sputtering target,readyfor use.3.1.2
6、material lot,n for the purpose of this standard,a“lot”is material consolidated into one ingot,and processed asone continuous batch in subsequent thermal-mechanical treat-ments.3.1.3 target specification,nfor the purpose of this stan-dard,a specification for a sputtering target source material forele
7、ctronic thin film applications.3.2 Abbreviations:3.2.1 mdlminimum detection limit4.Impurities4.1 The minimum set of metallic impurity elements to beanalyzed shall be developed and listed in the target specifica-tion or agreed upon by the purchaser and supplier.4.2 Acceptable analysis methods and det
8、ection limits are tobe specified in the target specification.Elements not detectedwill be counted and reported as present at the minimumdetection limit(“mdl”)for the method used.Additional ele-ments may be analyzed and reported as agreed upon betweenthe purchaser and the supplier,but these elements
9、shall not becounted in defining the grade designation.4.3 Certain elements may present particular analysis prob-lems,such as interferences.The limits,analysis method,andmdl may,in such cases,be as agreed upon between thepurchaser and the supplier.4.4 Nonmetallic elements,which shall be analyzed andr
10、eported,are carbon,hydrogen,nitrogen,oxygen,and sulfur.Maximum limits for nonmetallic impurities shall be agreedupon between the purchaser and the supplier.4.5 Acceptable limits and analytical techniques for particu-lar elements in critical applications may be agreed uponbetween the purchaser and th
11、e supplier.5.Classification5.1 Grades of metallic sputtering targets are defined in Table1,based upon total metallic impurity content of the set ofelements as specified in 4.1.Impurity contents are reported inparts per million by weight(wt ppm).5.2 Purity grade and total metallic impurity levels are
12、 basedupon the set of elements as specified in 4.1.6.Sampling6.1 Analysis for impurities and gases shall be performed onsamples that represent the finished sputtering target.6.1.1 Unless otherwise agreed upon between the purchaserand the supplier,impurity analyses for metallic and nonmetal-lic impur
13、ities shall be made by the supplier for one or more1This guide is under the jurisdiction of ASTM Committee F01 on Electronicsand is the direct responsibility of Subcommittee F01.17 on Sputter Metallization.Current edition approved June 1,2011.Published June 2011.Originallyapproved in 2001.Last previ
14、ous edition approved in 2007 as F2113-01(07).DOI:10.1520/F2113-01R11.2For referenced ASTM standards,visit the ASTM website,www.astm.org,orcontact ASTM Customer Service at serviceastm.org.For Annual Book of ASTMStandards volume information,refer to the standards Document Summary page onthe ASTM websi
15、te.Copyright ASTM International,100 Barr Harbor Drive,PO Box C700,West Conshohocken,PA 19428-2959.United States1 sample specimens that are representative of the production lot.If more than one sample specimen is used,the results of theanalyses shall be averaged to establish conformance with thegrade
16、 designation(5.1),other metallic impurity limits(4.2,4.3,and 4.5),and the agreed upon limits for nonmetallic content(4.4).7.Analytical Methods7.1 Analysis for impurities listed as specified in Section 4shall be performed using methods,techniques and mdls appro-priate to the material,grade and special agreements(4.3-4.5):7.1.1 Trace Metallic ImpuritiesThe target specificationshould state the preferred method of analysis.Mdl should be0.01 wt.ppm for 6N grade,0.1 ppm for 5N5 and 5N grade,and 1 wt.p
