1、Designation:F 637 85(Reapproved 2001)Standard Specification forFormat,Physical Properties,and Test Methods for 19 and35 mm Testable Tape Carrier for Perimeter Tape Carrier-Bonded Semiconductor Devices1This standard is issued under the fixed designation F 637;the number immediately following the desi
2、gnation indicates the year oforiginal adoption or,in the case of revision,the year of last revision.A number in parentheses indicates the year of last reapproval.Asuperscript epsilon(e)indicates an editorial change since the last revision or reapproval.INTRODUCTIONIt is the purpose of this specifica
3、tion to facilitate interchangeability of carrier tape produced byvarious manufacturers.Standardization is also intended to promote efficient utilization of equipmentused to test devices on tape and assemble them to hybrid circuits.A complete description of aparticular carrier tape requires specifica
4、tion of a considerable number of parameters not covered bythis standard.This standard specification includes only elements of format design for which substantialconsensus with respect to technically and economically sound commercial practice has been achieved.1.Scope1.1 This specification covers sta
5、ndard formats for testablesemiconductor lead carrier tape suitable for hybrid applica-tions.1.2 This standard specifies tape width,configuration,andlocation of guide perforations(“sprocket holes”),location oflead pattern frames on tape,lead pattern window size,andplacement of outer lead bond and ele
6、ctrical test pad areas in thelead pattern.1.3 The values stated in inch-pound units are to be regardedas the standard.The values given in parentheses are forinformation only.1.4 The following hazard caveat pertains only to the testmethod portion,Section 7 of this specification.This standarddoes not
7、purport to address all of the safety concerns,if any,associated with its use.It is the responsibility of the user of thisstandard to establish appropriate safety and health practicesand determine the applicability of regulatory limitations priorto use.2.Terminology2.1 Definitions:2.1.1 lead pattern
8、windowin tape carrier bonding,the areain each frame in which plastic backing of plastic/metalcomposite tape is totally or partially removed to exposeappropriate areas of bare conducting leads for attachment to amicroelectronic device on the inner end and a mountingsubstrate on the outer end.2.1.2 ou
9、ter lead bond areain tape carrier bonding,thatarea on each lead which will be connected to a mountingsubstrate.2.1.3 tape formatin tape carrier bonding,the layout de-sign elements of carrier tape,including the topographicalarrangement of lead pattern elements and test contacts in eachframe,descripti
10、on of the placement of frames upon the tape,and the specification of tape width and the placement ofmechanical handling aids,such as guide perforations.2.1.4 testable tape carrierin microelectronic fabrication,a continuous length of plastic/metal composite film,superfi-cially resembling motion pictu
11、re film,which carries at eachframe position a repetitive pattern of electrically conductingleads and test contacts.2.1.4.1 DiscussionThe lead arrangement is designed so asto electrically interconnect points on a microelectronic devicewith contacts on the mounting substrate of the device.The testcont
12、acts permit static or dynamic evaluation,or both,of eachmicroelectronic device prior to assembly to a mounting sub-strate.2.1.5 test padsin tape carrier bonding,conducting areas ineach tape frame position that can be contacted electrically byprobes in order to test devices attached to the tape.3.Cla
13、ssification3.1 A wide variety of formats are covered under thisstandard.Tape format style is classified according to thefollowing code:“Style ABCDEFGHIJ”1This specification is under the jurisdiction of ASTM Committee F01 onElectronics and is the direct responsibility of Subcommittee F01.07 on WireBo
14、nding,Flip Chip,and Tape Automated Bonding.Current edition approved Aug.30,1985.Published October 1985.Originallypublished as F 637 79.Last previous edition F 637 79.1Copyright ASTM International,100 Barr Harbor Drive,PO Box C700,West Conshohocken,PA 19428-2959,United States.where:A=nominal tape wid
15、th in millimeters(see Table 1),B=pattern pitch expressed as an integral multiple of thestandard sprocket pitch of 0.1870 inch(for example,4=4 sprocket pitch=0.7480 inch)(see Table 1),C=side dimension of square lead pattern window inmillimeters(see Table 1),D=base film material:K=Polyimide M=Polyeste
16、r,E=base film thickness expressed in mils(for example,5=0.005 in.),F=copper type:ED=Electrodeposited AR=As-Rolled,G=copper thickness expressed in ounces(for example,1=1 oz=0.0014 in.),H=lead configuration:P=Planar B=Bumped,I=leadfinish:CU=Copper(nofinish)SN=TinAU=GoldJ=pattern style:S=all leads electrically connected to acommon conductor for plating,static grounding,etc.O=all leads electrically isolated.NOTE1Example of a tape format style classification,as follows:“Style 3547K5ED1PSNO”This tape
