1、INTERNATIONALSTANDARDIEC60191-6-5First edition2001-08Mechanical standardizationof semiconductor devices Part 6-5:General rules for the preparation of outlinedrawings of surface mounted semiconductordevice packages Design guide for fine-pitch ball grid array(FBGA)Normalisation mcanique des dispositif
2、s semiconducteursPartie 6-5:Rgles gnrales pour la prparation des dessinsdencombrement des dispositifs semiconducteurs montage en surface Guide de conception pour les botiers matriciels billeset pas fins(FBGA)Reference numberIEC 60191-6-5:2001(E)LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL
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9、2 919 02 11Fax:+41 22 919 03 00LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.INTERNATIONALSTANDARDIEC60191-6-5First edition2001-08Mechanical standardizationof semiconductor devices Part 6-5:General rules for the preparation of outlin
10、edrawings of surface mounted semiconductordevice packages Design guide for fine-pitch ball grid array(FBGA)Normalisation mcanique des dispositifs semiconducteursPartie 6-5:Rgles gnrales pour la prparation des dessinsdencombrement des dispositifs semiconducteurs montage en surface Guide de conception
11、 pour les botiers matriciels billeset pas fins(FBGA)PRICE CODE IEC 2001 Copyright-all rights reservedNo part of this publication may be reproduced or utilized in any form or by any means,electronic ormechanical,including photocopying and microfilm,without permission in writing from the publisher.Int
12、ernational Electrotechnical Commission3,rue de Varemb Geneva,SwitzerlandTelefax:+41 22 919 0300e-mail:inmailiec.ch IEC web site http:/www.iec.chKFor price,see current catalogue Commission Electrotechnique Internationale International Electrotechnical CommissionLICENSED TO MECON Limited.-RANCHI/BANGA
13、LOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 60191-6-5 IEC:2001(E)INTERNATIONAL ELECTROTECHNICAL COMMISSIONMECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-5:General rules for the preparation of outline drawingsof surface mounted semiconductor device packages
14、 Design guide for fine-pitch ball grid array(FBGA)FOREWORD1)The IEC(International Electrotechnical Commission)is a worldwide organization for standardization comprisingall national electrotechnical committees(IEC National Committees).The object of the IEC is to promoteinternational co-operation on a
15、ll questions concerning standardization in the electrical and electronic fields.Tothis end and in addition to other activities,the IEC publishes International Standards.Their preparation isentrusted to technical committees;any IEC National Committee interested in the subject dealt with mayparticipat
16、e in this preparatory work.International,governmental and non-governmental organizations liaisingwith the IEC also participate in this preparation.The IEC collaborates closely with the InternationalOrganization for Standardization(ISO)in accordance with conditions determined by agreement between thetwo organizations.2)The formal decisions or agreements of the IEC on technical matters express,as nearly as possible,aninternational consensus of opinion on the relevant subjects since each technical
