1、 IEC 61188-5-4Edition 1.0 2007-10INTERNATIONAL STANDARD Printed boards and printed board assemblies Design and use Part 5-4:Attachment(land/joint)considerations Components with J leads on two sides IEC 61188-5-4:2007(E)LICENSED TO MECON Limited.-RANCHI/BANGALORE,FOR INTERNAL USE AT THIS LOCATION ONL
2、Y,SUPPLIED BY BOOK SUPPLY BUREAU.THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC,Geneva,Switzerland All rights reserved.Unless otherwise specified,no part of this publication may be reproduced or utilized in any form or by any means,electronic or mechanical,including photocopying and micr
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4、nal Committee for further information.IEC Central Office 3,rue de Varemb CH-1211 Geneva 20 Switzerland Email:inmailiec.ch Web:www.iec.ch About the IEC The International Electrotechnical Commission(IEC)is the leading global organization that prepares and publishes International Standards for all elec
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9、Tel.:+41 22 919 02 11 Fax:+41 22 919 03 00 LICENSED TO MECON Limited.-RANCHI/BANGALORE,FOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.IEC 61188-5-4Edition 1.0 2007-10INTERNATIONAL STANDARD Printed boards and printed board assemblies Design and use Part 5-4:Attachment(land/join
10、t)considerations Components with J leads on two sides INTERNATIONAL ELECTROTECHNICAL COMMISSION PICS 31.180 PRICE CODEISBN 2-8318-9341-0LICENSED TO MECON Limited.-RANCHI/BANGALORE,FOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 61188-5-4 IEC:2007(E)CONTENTS FOREWORD.3 INTRODU
11、CTION.5 1 Scope.6 2 Normative references.6 3 General information.6 3.1 General component description.6 3.2 Marking.7 3.3 Packaging.7 3.4 Process considerations.7 4 Small outlined J packages(SOJ).7 4.1 Component description.7 4.2 Component dimensions.8 4.3 Solder joint fillet design.9 4.4 Land patter
12、n dimensions.11 Bibliography.15 Figure 1 SOJ construction.8 Figure 2 SOJ component dimensions.9 Figure 3 Solder joint fillet design.11 Figure 4 SOJ land pattern dimensions.14 LICENSED TO MECON Limited.-RANCHI/BANGALORE,FOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.61188-5-4 I
13、EC:2007(E)3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES DESIGN AND USE Part 5-4:Attachment(land/joint)considerations Components with J leads on two sides FOREWORD 1)The International Electrotechnical Commission(IEC)is a worldwide organization for standardi
14、zation comprising all national electrotechnical committees(IEC National Committees).The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields.To this end and in addition to other activities,IEC publishes Internation
15、al Standards,Technical Specifications,Technical Reports,Publicly Available Specifications(PAS)and Guides(hereafter referred to as“IEC Publication(s)”).Their preparation is entrusted to technical committees;any IEC National Committee interested in the subject dealt with may participate in this prepar
16、atory work.International,governmental and non-governmental organizations liaising with the IEC also participate in this preparation.IEC collaborates closely with the International Organization for Standardization(ISO)in accordance with conditions determined by agreement between the two organizations.2)The formal decisions or agreements of IEC on technical matters express,as nearly as possible,an international consensus of opinion on the relevant subjects since each technical committee has repres
