1、 IEC 61188-5-3Edition 1.0 2007-10INTERNATIONAL STANDARD Printed boards and printed board assemblies Design and use Part 5-3:Attachment(land/joint)considerations Components with gull-wing leads on two sides IEC 61188-5-3:2007(E)LICENSED TO MECON Limited.-RANCHI/BANGALORE,FOR INTERNAL USE AT THIS LOCA
2、TION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC,Geneva,Switzerland All rights reserved.Unless otherwise specified,no part of this publication may be reproduced or utilized in any form or by any means,electronic or mechanical,including photocopying
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9、ciec.ch Tel.:+41 22 919 02 11 Fax:+41 22 919 03 00 LICENSED TO MECON Limited.-RANCHI/BANGALORE,FOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.IEC 61188-5-3Edition 1.0 2007-10INTERNATIONAL STANDARD Printed boards and printed board assemblies Design and use Part 5-3:Attachment(l
10、and/joint)considerations Components with gull-wing leads on two sides INTERNATIONAL ELECTROTECHNICAL COMMISSION UICS 31.180 PRICE CODEISBN 2-8318-9340-2LICENSED TO MECON Limited.-RANCHI/BANGALORE,FOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 61188-5-3 IEC:2007(E)CONTENTS FO
11、REWORD.4 INTRODUCTION.6 1 Scope.7 2 Normative references.7 3 General information.7 3.1 General component description.7 3.2 Marking.7 3.3 Carrier packaging format.7 3.4 Process considerations.7 4 TSOP(Type 1).8 4.1 Field of application.8 4.2 Component description.8 4.3 Component dimensions.8 4.4 Sold
12、er joint fillet design.9 4.5 Land pattern dimensions.11 5 TSOP(Type 2).13 5.1 Field of application.13 5.2 Component description.13 5.3 Component dimensions.13 5.4 Solder joint fillet design.14 5.5 Land pattern dimensions.16 6 SOP.18 6.1 Field of application.18 6.2 Component description.18 6.3 Compon
13、ent dimensions.18 6.4 Solder joint fillet design.19 6.5 Land pattern dimensions.21 7 SSOP.23 7.1 Field of application.23 7.2 Component description.23 7.3 Component dimensions.24 7.4 Solder joint fillet design.24 7.5 Land pattern dimensions.26 Bibliography.29 Figure 1 TSOP(Type 1)construction.8 Figur
14、e 2 TSOP(Type 1)Component dimensions.9 Figure 3 Solder joint fillet design(see IEC 61188-5-1,Tables 2 and 3).11 Figure 4 TSOP(Type 1)Land pattern dimensions.13 Figure 5 TSOP(Type 2)construction.13 Figure 6 TSOP(Type 2)Component dimensions.14 Figure 7 Solder joint fillet design(see IEC 61188-5-1,Tabl
15、es 2 and 3).16 Figure 8 TSOP(Type 2)Land pattern dimensions.18 LICENSED TO MECON Limited.-RANCHI/BANGALORE,FOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.61188-5-3 IEC:2007(E)3 Figure 9 SOPIC construction.18 Figure 10 SOP component dimensions.19 Figure 11 Solder joint fillet d
16、esign(see IEC 61188-5-1,Table 2).21 Figure 12 SOP Land pattern dimensions.23 Figure 13 SSOP construction.23 Figure 14 Component dimensions.24 Figure 15 Solder joint fillet design(see IEC 61188-5-1,Table 2).26 Figure 16 Land pattern dimensions.28 LICENSED TO MECON Limited.-RANCHI/BANGALORE,FOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.4 61188-5-3 IEC:2007(E)INTERNATIONAL ELECTROTECHNICAL COMMISSION _ PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES DESIGN AND USE Part 5-3:Attac
