1、INTERNATIONALSTANDARDIEC60748-23-1QC 165000-1First edition2002-05Semiconductor devices Integrated circuits Part 23-1:Hybrid integrated circuits and film structures Manufacturing line certification Generic specificationDispositifs semiconducteurs Circuits intgrs Partie 23-1:Circuits intgrs hybrides e
2、t structures par films Certification de la ligne de fabrication Spcification gnriqueReference numberIEC 60748-23-1:2002(E)LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.Publication numberingAs from 1 January 1997 all IEC publications
3、are issued with a designation in the60000 series.For example,IEC 34-1 is now referred to as IEC 60034-1.Consolidated editionsThe IEC is now publishing consolidated versions of its publications.For example,edition numbers 1.0,1.1 and 1.2 refer,respectively,to the base publication,thebase publication
4、incorporating amendment 1 and the base publication incorporatingamendments 1 and 2.Further information on IEC publicationsThe technical content of IEC publications is kept under constant review by the IEC,thus ensuring that the content reflects current technology.Information relating tothis publicat
5、ion,including its validity,is available in the IEC Catalogue ofpublications(see below)in addition to new editions,amendments and corrigenda.Information on the subjects under consideration and work in progress undertakenby the technical committee which has prepared this publication,as well as the lis
6、tof publications issued,is also available from the following:IEC Web Site(www.iec.ch)Catalogue of IEC publicationsThe on-line catalogue on the IEC web site(www.iec.ch/catlg-e.htm)enablesyou to search by a variety of criteria including text searches,technicalcommittees and date of publication.On-line
7、 information is also available onrecently issued publications,withdrawn and replaced publications,as well ascorrigenda.IEC Just PublishedThis summary of recently issued publications(www.iec.ch/JP.htm)is alsoavailable by email.Please contact the Customer Service Centre(see below)forfurther informatio
8、n.Customer Service CentreIf you have any questions regarding this publication or need further assistance,please contact the Customer Service Centre:Email:custserviec.chTel:+41 22 919 02 11Fax:+41 22 919 03 00LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED B
9、Y BOOK SUPPLY BUREAU.INTERNATIONALSTANDARDIEC60748-23-1QC 165000-1First edition2002-05Semiconductor devices Integrated circuits Part 23-1:Hybrid integrated circuits and film structures Manufacturing line certification Generic specificationDispositifs semiconducteurs Circuits intgrs Partie 23-1:Circu
10、its intgrs hybrides et structures par films Certification de la ligne de fabrication Spcification gnrique IEC 2002 Copyright-all rights reservedNo part of this publication may be reproduced or utilized in any form or by any means,electronic ormechanical,including photocopying and microfilm,without p
11、ermission in writing from the publisher.International Electrotechnical Commission,3,rue de Varemb,PO Box 131,CH-1211 Geneva 20,SwitzerlandTelephone:+41 22 919 02 11 Telefax:+41 22 919 03 00 E-mail:inmailiec.ch Web:www.iec.chXCFor price,see current cataloguePRICE CODECommission Electrotechnique Inter
12、nationaleInternational Electrotechnical Commission LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 60748-23-1 IEC:2002(E)CONTENTSFOREWORD.3INTRODUCTION.51Scope.62Normative references.63Definitions.84Standard and preferred values.105M
13、arking.105.1Circuit.105.2Despatch primary pack.116Quality assessment procedures.116.1General.116.2Procedures for manufacturing line certification.146.3Description of capability.146.4Qualifying components.156.5Procedures following the granting of manufacturing line certification.196.6Release for deli
14、very.207Test and measurement procedures.227.1General.227.2Standard conditions for testing.227.3Visual inspections and package dimensions.257.4Electrical measurement procedures.257.5Environmental test procedures.27Annex A(normative)Product assessment level schedules(PALS).59Annex B(informative)Custom
15、er information Application of these specifications withparticular reference to produce assessment level schedules(PALS).73Bibliography.85Figure 1 Definition of axes for mechanical and other tests.24Figure 2 Pulling force for bond strength test.53Figure 3 Apparatus requirements for the added componen
16、t bond strengthdestructive test.58Table 1 Severities for damp heat,steady-state,Method 2.29Table 2 Severities for damp heat,steady-state,Method 3.31Table 3 Preferred conditions for shock.34Table 4 Parameters for sealing test Method 1.38Table 5 Preheat times.42Table 6 Minimum pulling force.52LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.60748-23-1 IEC:2002(E)3 INTERNATIONAL ELECTROTECHNICAL COMMISSION_SEMICONDUCTOR DEVICES INTEGRA
