1、INTERNATIONALSTANDARDIEC60191-6-10First edition2003-11Mechanical standardization of semiconductor devices Part 6-10:General rules for the preparation of outline drawings ofsurface mounted semiconductor device packages Dimensions of P-VSONNormalisation mcanique des dispositifs semiconducteurs Partie
2、6-10:Rgles gnrales pour la prparation des dessinsdencombrement des dispositifs semiconducteurspour montage en surface Dimensions des botiers P-VSONReference numberIEC 60191-6-10:2003(E)LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.Pu
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9、00 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.INTERNATIONALSTANDARDIEC60191-6-10First edition2003-11Mechanical standardization of semiconductor devices Part 6-10:General rules for the preparation of outline drawings ofsurface moun
10、ted semiconductor device packages Dimensions of P-VSONNormalisation mcanique des dispositifs semiconducteurs Partie 6-10:Rgles gnrales pour la prparation des dessinsdencombrement des dispositifs semiconducteurspour montage en surface Dimensions des botiers P-VSON IEC 2003 Copyright-all rights reserv
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13、Y BOOK SUPPLY BUREAU.2 60191-6-10 IEC:2003(E)INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-10:General rules for the preparation of outline drawings of surface mounted semiconductor device packages Dimensions of P-VSON FOREWORD 1)The Internatio
14、nal Electrotechnical Commission(IEC)is a worldwide organization for standardization comprising all national electrotechnical committees(IEC National Committees).The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fie
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