1、 IEC/TS 62647-1 Edition 1.0 2012-08 TECHNICAL SPECIFICATION Process management for avionics Aerospace and defence electronic systems containing lead-free solder Part 1:Preparation for a lead-free control plan IEC/TS 62647-1:2012(E)colourinsideCopyrighted material licensed to BR Demo by Thomson Reute
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10、ontrolled when printed.IEC/TS 62647-1Edition 1.0 2012-08TECHNICAL SPECIFICATIONProcess management for avionics Aerospace and defence electronic systems containing lead-free solder Part 1:Preparation for a lead-free control plan INTERNATIONAL ELECTROTECHNICAL COMMISSION VICS 03.100.50;31.020;49.060 P
11、RICE CODEISBN 978-2-83220-298-2 Registered trademark of the International Electrotechnical Commission Warning!Make sure that you obtained this publication from an authorized distributor.colourinsideCopyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,downloaded on Nov-27-2014
12、 by James Madison.No further reproduction or distribution is permitted.Uncontrolled when printed.2 TS 62647-1 IEC:2012(E)CONTENTS FOREWORD.4 INTRODUCTION.6 1 Scope.7 2 Normative references.7 3 Terms and definitions.8 4 Symbols and abbreviated terms.11 5 Objectives.11 5.1 General.11 5.2 Reliability.1
13、2 5.3 Configuration control and product identification.12 5.4 COTS assemblies and sub-assemblies.12 5.5 Deleterious effects of tin whiskers.12 5.6 Repair,rework,maintenance,and support.12 6 Technical requirements.12 6.1 General.12 6.2 Reliability.12 6.2.1 General.12 6.2.2 Test and analysis methods.1
14、3 6.2.3 Environmental and operating conditions.13 6.2.4 Data.13 6.2.5 Conversion of results from available data to applicable conditions.14 6.3 Configuration control and product identification.14 6.3.1 General.14 6.3.2 Termination materials and finishes.14 6.3.3 Solder alloys used in the assembly pr
15、ocess.15 6.3.4 Wiring and connector assemblies.15 6.3.5 Changes in solder alloys.15 6.3.6 Identification.16 6.3.7 Part number changes.16 6.4 COTS assemblies and sub-assemblies.16 6.4.1 General.16 6.4.2 COTS assembly and sub-assembly configuration control and product identification.16 6.5 Deleterious
16、 effects of tin whiskers.16 6.6 Repair,rework,maintenance,and support.16 7 Plan administrative requirements.17 7.1 Plan organization.17 7.2 Terms and definitions.17 7.3 Plan point of contact.17 7.4 References.17 7.5 Requirements for suppliers and sub-contractors.17 7.6 Plan acceptance.17 7.7 Plan modifications.17 Annex A(informative)Template for tailoring requirements of IEC/TS 62647-1.18 Copyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,downloaded on Nov-27-2014 b
