1、 IEC/TR 62658 Edition 1.0 2013-07 TECHNICAL REPORT Roadmap of optical circuit boards and their related packaging technologies IEC/TR 62658:2013(E)colourinsideCopyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,downloaded on Nov-27-2014 by James Madison.No further reproductio
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9、 the Customer Service Centre:csciec.ch.Copyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,downloaded on Nov-27-2014 by James Madison.No further reproduction or distribution is permitted.Uncontrolled when printed.IEC/TR 62658Edition 1.0 2013-07TECHNICAL REPORT Roadmap of opt
10、ical circuit boards and their related packaging technologies INTERNATIONAL ELECTROTECHNICAL COMMISSION RICS 33.180.01;33.180.99 PRICE CODEISBN 978-2-8322-0915-8 Registered trademark of the International Electrotechnical Commission Warning!Make sure that you obtained this publication from an authoriz
11、ed distributor.colourinsideCopyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,downloaded on Nov-27-2014 by James Madison.No further reproduction or distribution is permitted.Uncontrolled when printed.2 TR 62658 IEC:2013(E)CONTENTS FOREWORD.3 1 Scope.5 2 General.5 2.1 Backgr
12、ound of optical packaging technology road map.5 2.2 Advantages of optical interconnects.7 2.3 Planar embedded optical waveguides.9 3 Standardization of board-level optical packaging.9 3.1 Role of IEC TC86/JWG9(with TC91).9 3.2 Optical circuit boards 20.10 3.3 Optical backplanes 22.11 3.4 Optical cir
13、cuit board connectors 23.13 3.5 Opto-electronic modules on boards.14 3.6 Originating standards.15 4 Standardization road map.16 4.1 Performance trends for optical circuit boards.16 5 Standardization road map of optical circuit boards.17 Bibliography.18 Figure 1 Data transmission speed and capability
14、 trends for network traffic and server systems 2.6 Figure 2 Internet traffic and router power consumption in Japan 5.7 Figure 3 Increase of power consumption in future network.8 Figure 4 Comparison of power consumption of 10 Tbps electrical and optical routers.9 Figure 5 Discussion field in IEC TC86
15、/JWG9(with TC91).10 Figure 6 Classification of optical circuit boards.11 Figure 7 Four types of optical backplane applications.13 Figure 8 Classification of optical circuit board connectors.14 Figure 9 Classification of optical modules on boards.15 Figure 10 De facto-standards in Japan 24.15 Figure
16、11 Performance trends for optical circuit boards.16 Figure 12 Standardization roadmap of optical circuit board and its related optical packaging.17 Copyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,downloaded on Nov-27-2014 by James Madison.No further reproduction or distribution is permitted.Uncontrolled when printed.TR 62658 IEC:2013(E)3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ROADMAP OF OPTICAL CIRCUIT BOARDS AND THEIR RELATED PACKAGING TECHNOLOGIES FOREWORD
