1、 TECHNICAL REPORT IEC TR 62258-3 First edition2005-06 Semiconductor die products Part 3:Recommendations for good practice in handling,packing and storage Reference number IEC/TR 62258-3:2005(E)LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY B
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8、2 919 03 00 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.TECHNICAL REPORT IECTR 62258-3 First edition2005-06 Semiconductor die products Part 3:Recommendations for good practice in handling,packing and storage PRICE CODE IEC 2005 Cop
9、yright-all rights reserved No part of this publication may be reproduced or utilized in any form or by any means,electronic or mechanical,including photocopying and microfilm,without permission in writing from the publisher.International Electrotechnical Commission,3,rue de Varemb,PO Box 131,CH-1211
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11、ON ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 TR 62258-3 IEC:2005(E)CONTENTS FOREWORD.4 INTRODUCTION.6 1 Scope and object.7 2 Normative references.7 3 Terms and definitions.8 4 Handling Good practice.8 4.1 General.8 4.2 Working environmental controls.8 4.3 General handling precautions.8 4.4 Cleanroom goo
12、d practice.8 5 Process handling issues.12 5.1 Wafer sawing.12 5.2 Die sorting.13 6 Die and wafer transport and storage media.16 6.1 Wafer carriers and cassettes.16 6.2 In-process carriers and transport systems.17 6.3 Packing for shipment of unsawn wafers.17 6.4 Packing for shipment of sawn wafers.18
13、 6.5 Packing for shipment of single wafers.21 6.6 Packing for shipment of die using trays.21 6.7 Packing for shipment of die using tape-and-reel.25 6.8 Secondary packing for shipment.27 7 Storage good practice.28 7.1 Die and wafer storage.28 7.2 Short-term storage environment and conditions.28 7.3 S
14、torage time limitations.28 7.4 Sawn wafer on wafer frame or ring.29 7.5 Die products in the production area.29 7.6 Die in tape-and-reel.29 7.7 Dry-packed die products.29 8 Traceability good practice.29 8.1 General.29 8.2 Wafer traceability.29 8.3 Die products traceability.29 8.4 Wafer and die back s
15、ide marking.30 9 Guidelines for long-term storage(die banking)of bare die and wafers.30 9.1 General.30 9.2 Preparing for storage.30 9.3 Damage to die products during long-term storage.31 9.4 Long-term storage environment.31 9.5 Recommended inert atmosphere purity.32 9.6 Chemical contamination.32 9.7
16、 Electrical effects.33 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.TR 62258-3 IEC:2005(E)3 9.8 Protection from radiation.33 9.9 Periodic qualification of stored die products.33 10 Good practice for automated handling during assembly.34 10.1 Removal of die from shipping media.34 10.2 Equipment out of service.34 Annex A(informative)Planning checklist.35 Annex B(informative)Material specifications.41 Bibliography.44 Figure 1 Bevel
