1、 PUBLICLY AVAILABLE SPECIFICATION IEC PAS 61249-3-1Pre-Standard First edition2007-05 Materials for printed boards and other interconnecting structures Part 3-1:Copper-clad laminates for flexible boards(adhesive and non-adhesive types)Reference number IEC/PAS 61249-3-1:2007(E)LICENSED TO MECON Limite
2、d.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC,Geneva,Switzerland All rights reserved.Unless otherwise specified,no part of this publication may be reproduced or utilized in any form or by any means,
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8、t the Customer Service Centre FAQ or contact us:Email:csciec.ch Tel.:+41 22 919 02 11 Fax:+41 22 919 03 00 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.PUBLICLY AVAILABLE SPECIFICATIONIEC PAS 61249-3-1Pre-Standard First edition2007-
9、05 Materials for printed boards and other interconnecting structures Part 3-1:Copper-clad laminates for flexible boards(adhesive and non-adhesive types)PRICE CODE V For price,see current catalogueCommission Electrotechnique InternationaleInternational Electrotechnical Commission LICENSED TO MECON Li
10、mited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 PAS 61249-3-1 IEC:2007(E)CONTENTS FOREWORD.4 1 Scope.6 2 Normative references.6 3 Terms and definitions.6 4 Designation of copper-clad laminates.6 4.1 Copper-clad laminate.7 4.2 Base materials.7 4.3 Thickn
11、ess of the base material.7 4.4 Types of adhesives.8 4.5 Thickness of base materials and adhesives.8 4.6 Type of copper foil.9 4.7 Grade of copper foil.9 4.8 Copper-foil thickness.9 4.9 Types of profiles.10 4.10 Surface treatment to increase copper adhesivity and anti-rust.10 4.11 Symbol for flammabi
12、lity.10 5 Observation.10 5.1 Base film.10 5.2 Copper foil.11 5.3 CCL.11 6 Size.12 6.1 Base film.12 6.1.1 Thickness and its allowance.12 6.2 Copper foil.12 6.2.1 Thickness and its allowance.12 6.3 Adhesives.13 6.3.1 Adhesives.13 6.4 Copper-clad laminates.13 6.4.1 Thickness and its allowance.13 6.4.2
13、Sheet dimension and its allowance.13 6.4.3 Role dimension and its allowance.13 7 Properties.13 7.1 Base film.13 7.2 Copper foil.15 7.3 CCL.17 8 Package and labelling.25 Annex A(normative)Roughness test.26 Annex B(normative)Dimensional stability test.27 Appendix.30 Figure B.1 Test pattern for the dim
14、ensional stability test.27 Table 1 Copper-clad laminates.7 Table 2 Base materials.7 Table 3 Thickness of base material.8 Table 4 Adhesives.8 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.PAS 61249-3-1 IEC:2007(E)3 Table 5 Thickness o
15、f adhesives.9 Table 6 Grade of copper foil.9 Table 7 Thickness of copper foil(Types E and R).10 Table 8 Types of profiles.10 Table 9 Appearance of CCL.11 Table 10 Thickness and its allowance of base film.12 Table 11 Thickness and its allowance of copper foil(Types E and R).12 Table 12 Thickness and
16、its allowance of adhesives.13 Table 13 Properties of polyimide film.14 Table 14 Properties of copper foil(type E).15 Table 15 Properties of copper foil(type R).16 Table 16 Properties of CCL Adhesive type(three layers)/polyimide film base.17 Table 17 Properties of CCL Non-adhesive type(two layers)/polyimide film base+copper foil(casting).19 Table 18 Properties of CCL Non-adhesive type(two layers)/polyimide film base+copper foil(sputter/plating).21 Table 19 Properties of CCL Non-adhesive type(two
