1、 PUBLICLY AVAILABLE SPECIFICATION IEC PAS 62326-7-1 First edition2007-04 Performance guide for single-and double-sided flexible printed wiring boards Reference number IEC/PAS 62326-7-1:2007(E)LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BU
2、REAU.THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC,Geneva,Switzerland All rights reserved.Unless otherwise specified,no part of this publication may be reproduced or utilized in any form or by any means,electronic or mechanical,including photocopying and microfilm,without permission in
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8、1 Fax:+41 22 919 03 00 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.PUBLICLY AVAILABLE SPECIFICATIONIEC PAS 62326-7-1 First edition2007-04 Performance guide for single-and double-sided flexible printed wiring boards PRICE CODE X For
9、 price,see current catalogue Commission Electrotechnique InternationaleInternational Electrotechnical Commission LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 PAS 62326-7-1 IEC:2007(E)CONTENTS FOREWORD.5 1 Scope.6 2 Normative refer
10、ences.6 3 Terms and definitions.6 4 Test methods.6 5 Performance levels.7 6 Base materials.7 7 Visual inspection.7 7.1 Test environment.7 7.2 Test specimens.7 7.3 Tools for testing.7 7.4 Preparation of limit samples.7 7.5 Description of inspection.7 8 Dimensional inspections.23 8.1 Measurement of di
11、mension.23 8.2 External dimension.23 8.3 Thickness.24 8.4 Hole diameter.24 8.5 Conductor width.24 8.6 Cumulative pattern pitch.24 8.7 Distance between hole centers.25 8.8 Design minimum distance between board edge and conductor.26 8.9 Position accuracy.26 8.10 Registration of pressure sensitive or h
12、eatactivated adhesive(Including adhesive squeeze-out)to flexible printed board and stiffener.28 9 Electrical performance test.29 10 Mechanical performance test.30 11 Environmental performance.31 12 Chemical resistance.31 13 Cleanliness.31 14 Flame resistance.31 15 Marking,packaging,and storage.31 15
13、.1 Marking on products.32 15.2 Marking on package.32 15.3 Packaging and storage.32 Annex A Handling instruction manual handling of polyimide-base FPC.33 Annex B Ion migration test.35 Annex C Whisker test.36 Annex D Additional information Explanation on JPCA performance guide for single-and double-si
14、ded flexible printed wiring boards.38 Figure 1 Nicks and pinholes in conductor.8 Figure 2 Reduced area on land.8 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.PAS 62326-7-1 IEC:2007(E)3 Figure 3 Circumferential void at the component
15、hole.8 Figure 4 Unnecessary copper between conductor/spur and nodule of conductor.9 Figure 5 Unnecessary copper,spurs and nodules in an open area and nodules of conductor corners.9 Figure 6 Etched concave surface of the conductor and nodule at a conductor corner.10 Figure 7 Conductor delamination.10
16、 Figure 8 Scratch on conductor.11 Figure 9 Voids.11 Figure 10 Foreign substance.12 Figure 11 Lifting and delamination of coverlay and covercoat.13 Figure 12 Allowable squeeze-out of coverlay adhesive and ooze-out of covercoat and photosensitive resist.13 Figure 13 Plating defects.14 Figure 14 Penetration of plated metal or solder.16 Figure 15 Plating voids in plated through hole.17 Figure 16 Tear and nick.17 Figure 17 Burrs.17 Figure 18 Thready burrs.18 Figure 19 Foreign substance between board
