1、 IEC 62453-1Edition 1.0 2009-06INTERNATIONAL STANDARD Field device tool(FDT)interface specification Part 1:Overview and guidance IEC 62453-1:2009(E)LICENSED TO MECON Limited.-RANCHI/BANGALORE,FOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.THIS PUBLICATION IS COPYRIGHT PROTECTE
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9、ANCHI/BANGALORE,FOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.IEC 62453-1Edition 1.0 2009-06INTERNATIONAL STANDARD Field device tool(FDT)interface specification Part 1:Overview and guidance INTERNATIONAL ELECTROTECHNICAL COMMISSION WICS 25.040.40;35.100.05;35.110 PRICE CODEIS
10、BN 2-8318-1050-3 Registered trademark of the International Electrotechnical Commission LICENSED TO MECON Limited.-RANCHI/BANGALORE,FOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 62453-1 IEC:2009(E)CONTENTS FOREWORD.4 INTRODUCTION.6 1 Scope.7 2 Normative references.7 3 Terms,
11、definitions,symbols,abbreviations and conventions.7 3.1 Terms and definitions.7 3.2 Abbreviations.12 3.3 Conventions.12 4 FDT overview.12 4.1 State of the art.12 4.2 Objectives of FDT.13 4.2.1 General features.13 4.2.2 Device and module manufacturer benefits.14 4.2.3 System manufacturer and integrat
12、or benefits.14 4.2.4 Other applications.14 4.3 FDT model.15 4.3.1 General.15 4.3.2 Frame Applications.16 4.3.3 Device Type Manager.17 4.3.4 Communication Channel concept.18 4.3.5 Presentation object.20 5 Structure of the IEC 62453 series.20 5.1 Structure overview.20 5.2 Part 2 Concepts and detailed
13、description.21 5.3 Parts 3xy Communication profile integration.22 5.3.1 General.22 5.3.2 Communication profile integration IEC 61784 CPF 1.22 5.3.3 Communication profile integration IEC 61784 CPF 2.22 5.3.4 Communication profile integration IEC 61784 CP 3/1 and 3/2.22 5.3.5 Communication profile int
14、egration IEC 61784 CP 3/4,CP 3/5 and 3/6.22 5.3.6 Communication profile integration IEC 61784 CPF 6.22 5.3.7 Communication profile integration IEC 61784 CPF 9.23 5.3.8 Communication profile integration IEC 61784 CPF 15.23 5.4 Parts 4x Object model integration profiles.23 5.4.1 General.23 5.4.2 Objec
15、t model integration profile Common object model.23 5.5 Parts 5xy Communication profile implementation.23 5.5.1 General.23 5.5.2 Communication profile integration IEC 61784 CPF 1.23 5.5.3 Communication profile integration IEC 61784 CPF 2.24 5.5.4 Communication profile integration IEC 61784 CP 3/1 and
16、 3/2.24 5.5.5 Communication profile integration IEC 61784 CP 3/4,CP 3/5 and 3/6.24 5.5.6 Communication profile integration IEC 61784 CPF 6.24 5.5.7 Communication profile integration IEC 61784 CPF 9.24 5.5.8 Communication profile integration IEC 61784 CPF 15.24 LICENSED TO MECON Limited.-RANCHI/BANGALORE,FOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.62453-1 IEC:2009(E)3 5.6 Parts 6x DTM styleguides.25 5.6.1 General.25 5.6.2 Device Type Manager(DTM)styleguide for common obj
