1、Selected Technical Papers STP 1574Editors:M.R.MitchellStephen W.SmithTerry WoodsBrian BergNext-Generation Thermal Insulation Challenges and Opportunities Editors:?K.Stovall?SELECTED TECHNICAL PAPERSSTP1574Editors:Therese K.Stovall,Thomas WhitakerNext-Generation Thermal Insulation Challenges and Oppo
2、rtunitiesASTM Stock#STP1574ASTM International,100 Barr Harbor Drive,PO Box C700,West Conshohocken,PA 19438-2959.Library of Congress Cataloging-in-Publication DataNext-generation thermal insulation:challenges and opportunities/editors,Therese K.Stovall,Thomas Whitaker.pages cm“ASTM Stock#:STP1574.”In
3、cludes bibliographical references and index.ISBN 978-0-8031-7593-8(alk.paper)1.Insulating materials.2.Insulation(Heat)I.Stovall,Therese K.,editor of compilation.II.Whitaker,Thomas,editor of compilation.TH1715.N44 2014693.832-dc23 2014012017Copyright 2014 ASTM INTERNATIONAL,West Conshohocken,PA.All r
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7、uthors addressed all of the reviewers comments to the satisfaction of both the technical editor(s)and the ASTM International Committee on Publications.The quality of the papers in this publication refl ects not only the obvious eff orts of the authors and the technical editor(s),but also the work of
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9、al.Citation of PapersWhen citing papers from this publication,the appropriate citation includes the paper authors,“papertitle”,STP title and volume,STP number,Paper doi,ASTM International,West Conshohocken,PA,Paper,year listed in the footnote of the paper.A citation is provided on page one of each p
10、aper.Printed in Bay Shore,NYApril,2014 Th is compilation of Selected Technical Papers,STP1574,Next Generation Th ermal Insulation Challenges and Opportunities,contains peer-reviewed papers that were presented at a symposium held October 2324,2013 in Jacksonville,FL.Th e symposium was sponsored by AS
11、TM International Committee C16 on Th ermal Insulation.Th e Symposium Co-Chairpersons and STP Co-Editors are Th erese K.Stovall,Oak Ridge National Laboratory,Retired,Oak Ridge,TN,USA and Th omas Whitaker,Industrial Insulation Group,Retired,Grand Junction,CO,USA.Foreword Overview viiPerformance of Vac
12、uum Insulation Panel Constructed With FiberPowder Composite as Core Material 1P.Mukhopadhyaya,D.van Reenen,and N.NormandinDevelopment of an Advanced Foam Insulation Based on Thermosetting Resins 11F.A.Shutov,I.V.Scherbanev,and D.W.Yarbrough Full-Thickness Thermal Testing of Fiberglass Insulation Usi
13、ng an ASTM C518-10 Heat Flow Meter Apparatus 17P.M.Noonan and T.R.Jonas Standard Reference Material 1450d,Fibrous Glass Board,for Thermal Insulation Measurements 39R.R.Zarr and S.D.Leigh Development and Use of an Apparatus for In Situ Evaluation of the Thermal Performance of Building-Envelope Compon
14、ents 53W.C.Thresher and D.W.YarbroughMoisture Content Measurements in Wood and Wood-Based MaterialsAdvancements in Sensor Calibration and Low-Moisture-Content Regime 66N.Shukla,D.Kumar,D.Elliott,and J.KosnyHigh-Performance External Insulation and Finish System Incorporating Vacuum Insulation PanelsF
15、oam Panel Composite and Hot Box Testing 81A.Seitz,K.Biswas,K.Childs,L.Carbary,and R.SerinoAn Innovative Low-Emissivity Insulation Developed in Korea 101Y.C.Kwon,Y.O Kim,and G.Y.LeeDesign Considerations for Sustainable Extruded Polystyrene(XPS)Thermal Insulation 119R.E.Smith,J.M.Alcott,and M.H.MazorC
16、ontents An Investigation on Bio-Based Polyurethane Foam Insulation for Building Construction 131P.Mukhopadhyaya,M.-T.Ton-That,T.-D.Ngo,N.Legros,J.-F.Masson,S.Bundalo-Perc,and D.van ReenenLab-Scale Dynamic Thermal Testing of PCM-Enhanced Building Materials 142N.Shukla,P.Cao,R.Abhari,and J.KosnyPresentation at ASTM C16 Symposium on Next-Generation Thermal Insulation Challenges and Opportunities 155C.PettyEvaluation of Homogeneity Qualifi cation Criteria in the Accelerated Aging of Closed-Cell Foam
