1、 IEC/TS 61000-5-9Edition 1.0 2009-07TECHNICAL SPECIFICATION Electromagnetic compatibility(EMC)Part 5-9:Installation and mitigation guidelines System-level susceptibility assessments for HEMP and HPEM IEC/TS 61000-5-9:2009(E)BASIC EMC PUBLICATION LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNA
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9、ontact us:Email:csciec.ch Tel.:+41 22 919 02 11 Fax:+41 22 919 03 00 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.IEC/TS 61000-5-9Edition 1.0 2009-07TECHNICAL SPECIFICATION Electromagnetic compatibility(EMC)Part 5-9:Installation and
10、 mitigation guidelines System-level susceptibility assessments for HEMP and HPEM INTERNATIONAL ELECTROTECHNICAL COMMISSION XBICS 33.100.20 PRICE CODEISBN 2-8318-1051-0BASIC EMC PUBLICATION Registered trademark of the International Electrotechnical Commission LICENSED TO MECON Limited.-RANCHI/BANGALO
11、REFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 TS 61000-5-9 IEC:2009(E)CONTENTS FOREWORD.5 INTRODUCTION.7 1 Scope.8 2 Normative references.8 3 Terms and definitions.9 4 General.11 4.1 Introduction.11 4.2 Systems and subsystems.12 5 Interaction mechanisms and protection met
12、hods.13 5.1 General.13 5.2 Front-door coupling.13 5.3 Back-door coupling.13 5.4 Protection methods.14 6 Description of overall assessment methodology.14 6.1 Methodology.14 6.2 Subsystems and equipment characterization phase.16 6.3 System analysis phase.17 6.4 System test phase.17 6.4.1 General.17 6.
13、4.2 Low-level tests.18 6.4.3 High-level testing.18 6.5 Susceptibility assessment phase.20 6.6 The use of reverberation chambers to characterise immunity.20 Annex A(informative)Classification of effect.24 Annex B(informative)Good measurement practice.27 Annex C(informative)Computational electromagnet
14、ics.30 Annex D(informative)System level assessment HEMP.33 Annex E(informative)System level assessment HPEM.35 Annex F(informative)Limitations.39 Annex G(informative)Detailed description of low-level techniques.42 Annex H(informative)Detailed description of high-level test techniques.54 Annex I(info
15、rmative)Data processing and analysis.61 Bibliography.66 Figure 1 Example system architecture.12 Figure 2 Example of radiated HPEM at high frequencies 3.14 Figure 3 Methodology flowchart.15 Figure 4 Reverberation chamber results:all effects.21 Figure 5 Reverberation chamber results:susceptibilities.2
16、2 Figure 6 Frequency spectrum of several HPEM sources.23 Figure A.1 Classification of effect.24 Figure B.1 Effect of adding ferrites to connecting cable:swept frequency example.27 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.TS 61000-5-9 IEC:2009(E)3 Figure B.2 Effect of adding ferrite to connecting cable:reverberation chamber example.28 Figure B.3 Effect of adding ferrite to connecting cable:transient example(time domain).28 Fi
